1
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. LSI Logic Corporation, Katz & Cotton, August 13, 1996: US05545923 (166 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...


2
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. LSI Logic Corporation, Katz & Cotton, April 21, 1998: US05741726 (17 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...


3
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. LSI Logic Corporation, Katz & Cotton, February 18, 1997: US05604161 (4 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...


4
Ivor Barber: Semiconductor device assembly with minimized bond finger connections. April 20, 1999: US05895968 (4 worldwide citation)

A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed ...


5
Leah Miller, Ivor Barber, Aritharan Thurairajaratnam: Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs. LSI Corporation, Beyer Law Group, November 9, 2010: US07829424 (1 worldwide citation)

The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of ...


6
Leah Miller, Ivor Barber, Aritharan Thurairajaratnam: Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs. LSI Corporation, Beyer Law Group, March 24, 2009: US07508062 (1 worldwide citation)

The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of ...


7
Ivor Barber: Integrated circuit package and method having wire-bonded intra-die electrical connections. LSI Logic Corporation, Beyer Weaver & Thomas, February 6, 2007: US07173328 (1 worldwide citation)

A semiconductor package having a substrate mounted die. The die configured having active circuit components and a top surface having bond pads electrically connected with circuitry of the die. The bond pads commonly being formed above active circuit components. The bond pads being electrically inter ...


8
Leah Miller, Ivor Barber, Aritharan Thurairajaratnam: Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs. Lsi Logic Corporation, Lsi Corporation, November 6, 2008: US20080272863-A1

The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of ...


9
Ivor Barber: Integrated circuit package and method having wire-bonded intra-die electrical connections. LSI Logic Corporation, Lsi Logic Corporation, October 13, 2005: US20050224964-A1

A semiconductor package having a substrate mounted die. The die configured having active circuit components and a top surface having bond pads electrically connected with circuitry of the die. The bond pads commonly being formed above active circuit components. The bond pads being electrically inter ...


10
Leah Miller, Ivor Barber, Aritharan Thurairajaratnam: Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs. LSI Logic Corporation, Lsi Logic Corporation, September 14, 2006: US20060202303-A1

The present invention is directed to a method of fabricating an integrated circuit package having decoupling capacitors using a package design conceived for use without decoupling capacitors. The package is implemented with a minimal redesign of the original design and not requiring any redesign of ...



Click the thumbnails below to visualize the patent trend.