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Okamoto Masahiro, Itou Shouji, Nakao Osamu, Suzuki Takanao, Okude Satoshi: Printed wiring board and method for manufacturing printed wiring board. Fujikura, July 30, 2008: EP1951015-A1 (2 worldwide citation)

A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste ...


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Higuchi Reiji, Itou Shouji, Nakao Osamu: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, January 1, 2004: TW569653 (1 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


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Higuchi Reiji, Itou Shouji, Nakao Osamu: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, June 11, 2003: TW536926 (1 worldwide citation)

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is ...


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Okamoto Masahiro, Itou Shouji, Nakao Osamu, Suzuki Takanao, Okude Satoshi: (Ja) プリント配線基板及びプリント配線基板の製造方法, (En) Printed wiring board and method for manufacturing printed wiring board. Fujikura, Okamoto Masahiro, Itou Shouji, Nakao Osamu, Suzuki Takanao, Okude Satoshi, MIYOSHI Hidekazu, April 19, 2007: WO/2007/043639 (1 worldwide citation)

(EN) A printed wiring board is provided with a base material, which has at least one wiring and is composed of an adhesive insulating base material and a conductive layer formed on one plane of the insulating base material; a penetrating electrode which is connected to the conductive layer, penetrat ...


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Okamoto Masahiro, Itou Shouji, Nakao Osamu, Suzuki Takanao, Okude Satoshi: Printed wiring board and method for manufacturing printed wiring board. Fujikura, lujin hua huangqi hang, October 15, 2008: CN200680038255

A printed wiring board is provided with a base material, which has at least one wiring and is composed of an adhesive insulating base material and a conductive layer formed on one plane of the insulating base material; a penetrating electrode which is connected to the conductive layer, penetrates th ...


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Itou Shouji, Nakao Osamu, Higuchi Reiji, Okamoto Masahiro: Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method. Fujikura, zhong qiang fan weimin, July 13, 2005: CN03804421

A base for multilayer wiring boards in which a conductive layer (112) forming a wiring pattern is provided on one side of an insulating base (insulating resin layer (111)), and an adhesive layer (113) for interlayer adhesion is provided on the other side, and a through hole (114) extending through t ...


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Higuchi Reiji, Itou Shouji, Nakao Osamu: Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof. Fujikura, October 4, 2002: KR1020020015757

PURPOSE: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are provided to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. CONSTITUTION: A multilayer wiring board assembly compone ...


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Itou Shouji, Nakao Osamu, Higuchi Reiji, Okamoto Masahiro: Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method. Fujikura, September 6, 2004: KR1020047013058

A base for multilayer wiring boards in which a conductive layer (112) forming a wiring pattern is provided on one side of an insulating base (insulating resin layer (111)), and an adhesive layer (113) for interlayer adhesion is provided on the other side, and a through hole (114) extending through t ...


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