1
Mori Takeshi, Ito Toshihide, Takahara Norimitsu, Teramura Kosuke: Forklift work assisting device. Toyota, April 13, 2006: JP2006-096457 (35 worldwide citation)

PROBLEM TO BE SOLVED: To provide a forklift work assisting device capable of easily carrying out proper traveling and loading work of a forklift.SOLUTION: Perspective locusi Ufl and Ufr at tip end portions 3a of right and left forks 3, which are drawn when forward moving by a tire angle of a rear wh ...


2
Ito Toshihide: Multilayer printed wiring board, its manufacturing method and semiconductor device. Nec Toppan Circuit Solutions, September 24, 2004: JP2004-265967 (11 worldwide citation)

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board capable of forming a detailed wiring layer, a multilayer printed wiring board in which warp is hard to be generated, and to provide a semiconductor device.SOLUTION: The multilayer printed wiring board 100 is constitut ...


3
Ito Toshihide: Substrate for loading semiconductor chip, manufacturing method therefor, semiconductor device and manufacturing method therefor. Nec Toppan Circuit Solutions Toyama, August 15, 2003: JP2003-229512 (10 worldwide citation)

PROBLEM TO BE SOLVED: To provide a substrate for loading semiconductor chip and a semiconductor device, where the productivity of solder ball loading and bond strength of a solder ball are realized.SOLUTION: An uneven shape is formed on a copper plate 8 becoming a template, and BGA pads 5 are formed ...


4
Ito Toshihide, Hara Shiro: Solder, method for processing surface of printed wiring board, and method for mounting electronic part. Nippon Electric Co, Solder Coat, June 12, 2002: EP1213089-A1 (8 worldwide citation)

A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.


5
Ito Toshihide, Hara Shiro: Solder, surface treatment method of printed-wiring board using the same, and packaging method of electronic component using the surface treatment method. Nec Toyama, Sorudaa Kooto, August 30, 2002: JP2002-246742 (5 worldwide citation)

PROBLEM TO BE SOLVED: To provide solder that can restrain melting point to a degree for preventing faults in electronic components and at the same time, inhibit thinning of copper, to provide the surface treatment method of a printed-wiring board using the solder, and to provide the packaging method ...


6
Ito Toshihide: Method for manufacturing of multilayer semiconductor board. Nec Toyama, April 6, 2001: JP2001-094252 (4 worldwide citation)

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer semiconductor board which improves the wiring holding property of a core board, using the buildup method. SOLUTION: The method comprises etching Cu foils 101 on both surfaces of a Cu-lined laminate board 101 to make each foil th ...


7
Ito Toshihide, Hara Shiro: Solder and method for surface treatment for printed wiring board using the solder and method for mounting electronic components on the board using the solder. Nec Toyama, Sorudaa Kooto, April 10, 2001: JP2001-096394 (4 worldwide citation)

PROBLEM TO BE SOLVED: To provide a solder than can inhibit copper corrosion cracks while keeping a characteristic of high wettability and methods for surface treatment for printed wiring boards using the solder and for mounting electronic components on the surface of printed wire board using the sol ...


8
Ito Toshihide, Hara Shiro: Sn-ag-cu solder and surface treatment and parts mounting methods using the same. Nippon Electric Co, Solder Coat, April 4, 2001: EP1088615-A2 (3 worldwide citation)

A Pb-free solder is provided, which has a satisfactory low melting point and suppresses effectively the "copper leaching" phenomenon. The solder is difficult to be oxidized and has a high wettability. The solder consists essentially of (a) 1.0 to 4.0 wt% of Ag, (b) 0.4 to 1.3 wt% of Cu; (c) at least ...


9
Torikai Mineo, Ito Toshihide: Fuel supply system. Keihin, March 27, 2001: JP2001-082274 (3 worldwide citation)

PROBLEM TO BE SOLVED: To improve mountability of a fuel pump inside a sub-tank. SOLUTION: A first grommet is inserted into the outer periphery part PC on one side of a fuel pump P to be fixed and a second grommet 2 is inserted into the outer periphery part on the other side of the fuel pump P to be ...


10
Ito Toshihide: Substrate for semiconductor device, its manufacturing method, and semiconductor device. Nec Toppan Circuit Solutions, June 9, 2005: JP2005-150417 (3 worldwide citation)

PROBLEM TO BE SOLVED: To provide an extremely thin substrate for a semiconductor device suitable for a fine flip bonding system, and provide its manufacturing method and the semiconductor device.SOLUTION: The substrate 100 for a semiconductor device is configured such that a semiconductor mounting p ...