1
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yoshikatsu Mikami, Kuniteru Muto, Yoshiyuki Ikezoe: Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained. Hitachi Chemical Company, Antonelli Terry & Wands, April 26, 1988: US04740657 (112 worldwide citation)

Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insul ...


2
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, March 19, 1991: US05001542 (97 worldwide citation)

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having ...


3
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, June 9, 1992: US05120665 (91 worldwide citation)

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having ...


4
Isao Tsukagoshi, Yutaka Yamaguchi, Tadamitsu Nakayama: Anisotropic-electroconductive adhesive film. Hitachi Chemical, Antonelli Terry & Wands, March 15, 1988: US04731282 (71 worldwide citation)

An anisotropic-electroconductive adhesive film containing a small quantity of electroconductive particles having a special shape in an adhesive component layer which has a limited thickness is useful for connecting micro-sized circuits, etc. due to its anisotropy in electroconductivity and good tran ...


5
Isao Tsukagoshi, Hiroshi Matsuoka, Yukihisa Hirosawa, Yoshikatsu Mikami, Hisashi Dokochi: Semiconductor device having a semiconductor chip electrically connected to a wiring substrate. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, September 8, 1998: US05804882 (46 worldwide citation)

A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as su ...


6
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Process for connecting circuits and adhesive film used therefor. Hitachi Chemical, Antonelli Terry Stout & Kraus, December 1, 1998: US05843251 (46 worldwide citation)

An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.


7
Yasushi Goto, Isao Tsukagoshi, Tomohisa Ohta: Anisotropically electroconductive resin film. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, March 28, 2000: US06042894 (34 worldwide citation)

An isotropically electroconductive resin film material produced by sticking electroconductive particles to a sticking layer formed on a support and fixing therein, and filling a film-forming resin incompatible with the sticking material among the electroconductive particles, has electroconductivity ...


8
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Process for connecting circuits and adhesive film used therefor. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, September 5, 2000: US06113728 (30 worldwide citation)

An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.


9
Isao Tsukagoshi, Naoki Fukushima, Kouji Kobayashi, Jyunichi Koide, Kazuya Matsuda: A method of mounting a plurality of electronic parts on a circuit board. Hitachi Chemical, February 18, 1998: EP0824270-A2 (21 worldwide citation)

A method of mounting electronic parts (1) on a circuit board (9) comprises: an adhesive layer formation step of forming, on an electrode surface of each electronic part (1) on which electrodes are formed, a film-like thermosetting adhesive layer (4) having an area substantially equal to that of the ...


10
Isao Tsukagoshi, Kouji Kobayashi, Kazuya Matsuda, Naoki Fukushima, Jyunichi Koide: Adhesive-coated electronic parts on a connection sheet. Hitachi Chemical Company, Wenderoth Lind & Ponack L, January 11, 2005: US06841022 (20 worldwide citation)

An apparatus includes a connection sheet having a separator layer and an adhesive film layer formed on the separator layer such that said adhesive film layer can be peeled from the separator layer. The cohesive strength of the adhesive film layer decreases when the adhesive film layer is heated to a ...