1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi: Reconstituted wafer level stacking. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 8, 2011: US07901989 (83 worldwide citation)

A stacked microelectronic assembly is fabricated from a structure which includes a plurality of first microelectronic elements having front faces bonded to a carrier. Each first microelectronic element may have a first edge and a plurality of first traces extending along the front face towards the f ...


2
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, January 10, 2012: US08093697 (77 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


3
Belgacem Haba Belgacem (Bel) Haba
Hiroaki Sato, Teck Gyu Kang, Belgacem Haba, Philip R Osborn, Wei Shun Wang, Ellis Chau, Ilyas Mohammed, Norihito Masuda, Kazuo Sakuma, Kiyoaki Hashimoto, Kurosawa Inetaro, Tomoyuki Kikuchi: Package-on-package assembly with wire bonds to encapsulation surface. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 31, 2013: US08618659 (65 worldwide citation)

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Mirkarimi: Off-chip vias in stacked chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 13, 2011: US08076788 (54 worldwide citation)

A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 20, 2014: US08728865 (52 worldwide citation)

A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and expos ...


6
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 18, 2008: US07453157 (50 worldwide citation)

A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelect ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Teck Gyu Kang, Ilyas Mohammed, Ellis Chau: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 15, 2011: US08058101 (47 worldwide citation)

A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remot ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Multiple die face-down stacking for two or more die. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 25, 2012: US08338963 (44 worldwide citation)

A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned w ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Memory module in a package. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513817 (41 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the sub ...


10
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Teck Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John B Riley III, Ilyas Mohammed: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, December 11, 2012: US08329581 (37 worldwide citation)

A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer peri ...