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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, IIyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145550-A1

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...


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Belgacem Haba Belgacem (Bel) Haba
IIyas Mohammed, Belgacem Haba, Sean Moran, Wei Shun Wang, Ellis Chau, Christopher Wade: Microelectronic package. Tessera, Tessera, LERNER DAVID et al, February 19, 2009: US20090045524-A1

A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features ...


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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, IIyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, April 5, 2007: US20070077677-A1

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting ...


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Cyprian Uzoh, Vage Oganesian, Iiyas Mohammed: Systems and methods for producing flat surfaces in interconnect structures. Tessera, Haynes and Boone, September 1, 2015: US09123703

Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a co-planar or flat top surface. Another feature is a method of forming an in ...