Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, IIyas Mohammed, Craig S Mitchell, Michael Warner, Jesse Burl Thompson: Microelectronic elements with compliant terminal mountings and methods for making the same. Tessera, Tessera, LERNER DAVID et al, June 28, 2007: US20070145550-A1

A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps ...

Belgacem Haba Belgacem (Bel) Haba
IIyas Mohammed, Belgacem Haba, Sean Moran, Wei Shun Wang, Ellis Chau, Christopher Wade: Microelectronic package. Tessera, Tessera, LERNER DAVID et al, February 19, 2009: US20090045524-A1

A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features ...

Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Ronald Green, IIyas Mohammed, Stuart E Wilson, Wael Zohni, Yoichi Kubota, Jesse Burl Thompson: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, April 5, 2007: US20070077677-A1

A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting ...

Cyprian Uzoh, Vage Oganesian, Iiyas Mohammed: Systems and methods for producing flat surfaces in interconnect structures. Tessera, Haynes and Boone, September 1, 2015: US09123703

Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a co-planar or flat top surface. Another feature is a method of forming an in ...

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