1
Ichiro Katayama: Sintered diamond drill bits and method of making. William L Chapin, August 22, 1995: US05443337 (91 worldwide citation)

A drill bit for cutting hard and abrasive materials has cutting lips formed from sintered polycrystalline diamond (PCD) or polycrystalline cubic boron nitride (PCBN) contained in one or more inserts installed in a drill bit blank. The inserts are made by forming depressions in the upper surface of a ...


2
Ichiro Katayama: Sintered diamond drill bits and method of making. William L Chapin, February 29, 2000: US06029544 (87 worldwide citation)

A drill bit for cutting hard and abrasive materials has cutting lips formed from sintered polycrystalline diamond (PCD) or polycrystalline cubic boron nitride (PCBN) contained in one or more inserts installed in a drill bit blank. The inserts are made by forming depressions in the upper surface of a ...


3
Ichiro Katayama: Sintered diamond drill bits and method of making. William L Chapin, March 18, 1997: US05611251 (86 worldwide citation)

A drill bit for cutting hard and abrasive materials has cutting lips formed from sintered polycrystalline diamond (PCD) or polycrystalline cubic boron nitride (PCBN) contained in one or more inserts installed in a drill bit blank. The inserts are made by forming depressions in the upper surface of a ...


4
Ichiro Katayama, Hirosuke Kubota, Mitsuo Mochizuki, Kuniyoshi Sakane, Toshimichi Mihara, Tokuzo Kitawaki: Method and composition, including particular additive for hydraulic cement, for fixing waste matter. Kabushiki Kaisha Takenaka Komuten, Kabushiki Kaisha Takenaka Doboku, Edwin E Greigg, June 24, 1980: US04209335 (66 worldwide citation)

Solidification or consolidation, for fixation of various kinds of waste matter, soil etc. containing toxic contaminants affecting ecological system of the environment, by use of composition made up of hydraulic cement and particular additive. The additive essentially contains at least one sulfate, s ...


5
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, July 31, 2001: US06267648 (57 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


6
Ichiro Katayama: Bearing unit for sliding device. Wenderoth Lind & Ponack, January 7, 1986: US04563045 (13 worldwide citation)

The present invention provides a bearing unit which comprises a bearing unit body mounted on a sliding unit, a plurality of guiding surfaces including a guiding surface being formed on said bearing unit body so as not to intersect another guiding surface, and a plurality of roller units having a plu ...


7
Ichiro Katayama: Slicing method by a slicing machine. Tokyo Seimitsu, Oliff & Berridge, December 24, 1991: US05074276 (12 worldwide citation)

A slicing method by use of a slicing machine in which, after a cylindrical material is moved by a predetermined amount of indexing, the cylindrical material is moved to a rotating blade in the slicing direction of the blade and is sliced into a wafer having a predetermined thickness, and at the same ...


8
Ichiro Katayama: Method of reforming the ground. Takenaka Komuten Company, January 3, 1978: US04065933 (7 worldwide citation)

This invention relates to a method of forming a solid foundation in soft ground or stratum by mixing chemical agent into the soft ground soil to solidify it. This ground reforming method comprises the steps of driving a casing into the soft stratum to be reformed so that the casing encloses a volume ...


9
Ichiro Katayama, Masatami Iwaki, Kazumi Ikeda: Apparatus and method for chamfering wafer. Tokyo Seimitsu, David S Safran, Nixon Peabody, August 13, 2002: US06431961 (6 worldwide citation)

A grindstone and a wafer are rotated at high speeds in the same direction. The rotating wafer is slowly moved toward the rotating grindstone to thereby gradually chamfer the periphery of the wafer.


10
Ichiro Katayama, Yoshio Kamoshita: Slicing machine employing an axial force to provide rigidity to a rotary blade. Tokyo Seimitsu, Oliff & Berridge, February 22, 1994: US05287843 (6 worldwide citation)

A slicing machine for slicing an ingot using a rotary blade that maintains the inner peripheral cutting edge of the blade in a highly rigid state. The slicing machine slices the ingot into thin pieces by use of an inner peripheral cutting edge of a doughnut-shaped rotary blade in which an axial forc ...



Click the thumbnails below to visualize the patent trend.