1
Sung Eun Kim, Hyun Joo Jeon, Hwan Kyu Yoo, Ji Young Oh, Tae Kyun Kwon: Support platform of non-contact transfer apparatus. LG Display, Avaco, LG Electronics, McKenna Long & Aldridge, March 27, 2012: US08142111 (3 worldwide citation)

Provided is a support platform of a non-contact transfer apparatus. The support platform is arranged horizontally and includes first and second members adding a lift force to a first force for lifting peripheral portions of a transferred object, wherein the first force is lower than a second force l ...


2
Sung Eun Kim, Cheon Soo Lee, Hwan Kyu Yoo, Byung Han Yun: Sputtering apparatus. LG Display, Brinks Hofer Gilson & Lione, May 4, 2010: US07708866 (3 worldwide citation)

A sputtering apparatus comprises a substrate unit that includes a substrate on which a target material is deposited in a chamber and a target unit on which a plurality of target sections formed of the target material are arranged. The sputtering apparatus further comprises a cathode plate that suppl ...


3
Sang Eon Ahn, Hyun Joo Jeon, Hwan Kyu Yoo, Ji Young Oh, Cheon Soo Lee: Support platform of non-contact transfer apparatus. LG Display, AVACO, LG Electronics, McKenna Long & Aldridge, February 14, 2012: US08113761 (2 worldwide citation)

There is provided a support platform of a non-contact transfer apparatus. The support platform of a non-contact transfer apparatus includes a plurality of first holes each having a plurality of sub-holes arranged in a radial direction and a plurality of second holes arranged in a line proximate the ...


4
Sung Eun Kim, Hyun Joo Jeon, Hwan Kyu Yoo, Ji Young Oh, Tae Kyun Kwon: Support platform of non-contact transfer apparatus. LG Display, McKenna Long & Aldridge, April 19, 2011: US07927045 (1 worldwide citation)

Provided is a support platform of a non-contact transfer apparatus. The support platform is arranged horizontally and includes first and second members adding a lift force to a first force for lifting peripheral portions of a transferred object, wherein the first force is lower than a second force l ...


5
Tae Hyun Lim, Hwan Kyu Yoo, Byung Han Yun: Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same. LG Display, AVACO, LG Electronics, Morgan Lewis & Bockius, June 3, 2014: US08741116 (1 worldwide citation)

A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target devices disposed to be opposite to peripheral regions of the substrate, wherein the second and third target ...


6
Tae Hyun Lim, Hwan Kyu Yoo, Byung Han Yun: Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same. LG Display, AVACO, LG Electroncs, Morgan Lewis & Bockius, November 8, 2011: US08052850 (1 worldwide citation)

A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target devices disposed to be opposite to peripheral regions of the substrate, wherein the second and third target ...


7
Sung Eun Kim, Tae Hyun Lim, Hwan Kyu Yoo, Kwang Jong Yoo, Yang Sik Moon, Byeong Cheol An: Sputtering apparatus and driving method thereof. LG Display, AVACO, LG Electronics, Morgan Lewis & Bockius, June 25, 2013: US08470142

A sputtering apparatus for depositing a target material on a substrate includes a chamber, a target in the chamber to provide the target material, a carrier to carry the substrate in the chamber to face the target, and a plurality of masks arranged along sides of the carrier and being movable back a ...


8
Jin Seok Lee, Hyuk Sang Yoon, Hwan Kyu Yoo, Byeong Eok Hwang: Processing apparatus. LG Display, Avaco, LG Electronics, Morgan Lewis & Bockius, June 24, 2014: US08758513

A processing apparatus includes a loading chamber; a buffer chamber connected to the loading chamber; a first process chamber connected to the buffer chamber; and an unloading chamber connected to the first process chamber, wherein a processing path through the processing apparatus is a forward in-l ...


9
Hyuk Sang Yoon, Hwan Kyu Yoo, Byung Han Yun: Sputtering apparatus, method of driving the same, and method of manufacturing substrate using the same. LG Display, McKenna Long & Aldridge, July 19, 2011: US07981263

A sputtering apparatus includes a susceptor having a substrate and a plurality of target devices facing the substrate and substantially parallel to each other, each target device being rotatable.


10
Sang Eon Ahn, Hyun Joo Jeon, Hwan Kyu Yoo, Ji Young Oh, Cheon Soo Lee: Support platform of non-contact transfer apparatus. Mckenna Long & Aldridge, December 21, 2006: US20060284042-A1

There is provided a support platform of a non-contact transfer apparatus. The support platform of a non-contact transfer apparatus includes a plurality of first holes each having a plurality of sub-holes arranged in a radial direction and a plurality of second holes arranged in a line proximate the ...