1
Howard L Davidson: Optical transdermal link. Sun Microsystems, Blakely Sokoloff Taylor & Zafman, June 14, 1994: US05320098 (249 worldwide citation)

An optical transdermal link. The interface consists of two modules. An internal module is placed just inside the skin, and an external module is placed just outside the skin and facing the internal module. The external module is connected to a host processor via high speed serial lines. The external ...


2
Howard L Davidson: Ultrathin electronics. Sun Microsystems, Blakely Sokoloff Taylor & Zafman, March 9, 1999: US05880010 (115 worldwide citation)

An integrated circuit and associated method for reducing total signal propagation delay as well as power consumption and thermal dissipation. The integrated circuit comprises a plurality of active layers coupled together in close proximity. In order to produce the integrated circuit, at least two ac ...


3
Howard L Davidson: Three dimensional packaging arrangement for computer systems and the like. Sun Microsystems, Blakely Sokoloff Taylor & Zafman, November 12, 1991: US05065277 (87 worldwide citation)

A three dimensional arrangement for packaging planar arrays of circuit components in a plurality of essentially planar layers in which the layers lie closely adjacent to one another is disclosed. Each layer is separated by a shell that interposes slots for allowing coolant to pass between the layers ...


4
Howard L Davidson, Ehsan Ettehadieh, John Schulte: Optimized integral heat pipe and electronic circuit module arrangement. Sun Microsystems, Blakely Sokoloff Taylor & Zafman, June 1, 1993: US05216580 (80 worldwide citation)

An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber an ...


5
Howard L Davidson, Ehsan Ettehadieh: Integral heat pipe, heat exchanger, and clamping plate. Sun Microsystems, Blakely Sokoloff Taylor & Zafman, October 19, 1993: US05253702 (52 worldwide citation)

An integral heat pipe, heat exchanger, and clamping plate. A base plate functioning as an evaporator has disposed in it a multiplicity of intersecting parallel and perpendicular internal channels extending laterally substantially across the base plate. A sintered copper thermal wick is applied to al ...


6
Howard L Davidson: Optical transdermal linking method for transmitting power and a first data stream while receiving a second data stream. Sun Microsystems, Blakely Sokoloff Taylor & Zafman, February 7, 1995: US05387259 (51 worldwide citation)

An optical transdermal link. The interface consists of two modules. An internal module is placed just inside the skin, and an external module is placed just outside the skin and facing the internal module. The external module is connected to a host processor via high speed serial lines. The external ...


7
Donald E Tilton, Howard L Davidson, Nyles I Nettleton: Electronics equipment heat exchanger system. Isothermal Systems Research, Michael S Neustel, May 13, 2008: US07372698 (41 worldwide citation)

An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit fo ...


8
Nicholas J Colella, Howard L Davidson, John A Kerns, Daniel M Makowiecki: Composite material having high thermal conductivity and process for fabricating same. Regents of the University of California, L E Carnahan, July 21, 1998: US05783316 (37 worldwide citation)

A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and co ...


9
Howard L Davidson: Apparatus for cooling compact arrays of electronic circuitry. Sun Microsystems, Blakely Sokoloff Taylor & Zafman, January 7, 1992: US05079619 (36 worldwide citation)

In an arrangement for packaging planar arrays of circuit components including a plurality of essentially parallel layers in which the layers lie closely adjacent one another, one or more of the layers including a substrate of insulating material having circuit board apparatus imbedded therein, the i ...


10
Howard L Davidson: Sub-package bypass capacitor mounting for an array packaged integrated circuit. Sun Microsystems, B Noël Kivlin, Conley Rose & Tayon PC, June 4, 2002: US06400576 (31 worldwide citation)

Switching noise within an LGA-packaged or PGA-packaged IC Vdd and IC Vss nodes is reduced by spreading the electrical current in the bypass path to reduce the effective current loop area, and thus reduce the energy stored in the magnetic field surrounding the current path. This result is achieved by ...