John L Vaught, Frank L Cloutier, David K Donald, John D Meyer, Christopher A Tacklind, Howard H Taub: Thermal ink jet printer. Hewlett Packard Company, Douglas A Kundrat, Joseph H Smith, December 25, 1984: US04490728 (277 worldwide citation)

A thermal ink jet printer is disclosed in which ink droplets are ejected from an orifice by the explosive formation of a vapor bubble within the ink supply due to the application of a two part electrical pulse to a resistor within the ink supply. The electrical pulse comprises a precurser pulse and ...

Howard H Taub, Joan P Gallicano: Anisotropically etched ink fill slots in silicon. Hewlett Packard Company, May 3, 1994: US05308442 (116 worldwide citation)

An ink fill slot 18 can be precisely manufactured in a substrate 12 utilizing photolithographic techniques with chemical etching. N-type silicon wafers are double-side coated with a dielectric layer 26 comprising a silicon dioxide layer and/or a silicon nitride layer. A photoresist step, mask alignm ...

Ernest Bassous, Lawrence Kuhn, Arnold Reisman, Howard H Taub: Ink jet nozzle. International Business Machines Corporation, Jack M Arnold, February 8, 1977: US04007464 (82 worldwide citation)

In an ink jet printing system, a single nozzle or an array of nozzles are etched in a semiconductor material such as silicon. Each nozzle has polygonal or N-sided entrance and exit apertures of different cross-sectional area. Preferably, the nozzle is in the shape of a truncated pyramid with the ent ...

Alfred I Pan, Howard H Taub, Harold W Levie: Ink jet head incorporating a thick unpassivated TaAl resistor. Hewlett Packard Company, June 5, 1990: US04931813 (74 worldwide citation)

A thermal ink jet head incorporates bubble-generating resistors, each with a relatively thick layer of unpassivated resistive material, such as TaAl. The thermal ink jet head includes an ink source, ink channels, respective orifices, and circuitry for providing the electrical energy which the resist ...

Ernest Bassous, Lawrence Kuhn, Howard H Taub: Jet nozzle structure for electrohydrodynamic droplet formation and ink jet printing system therewith. International Business Machines Corporation, Bernard N Wiener, April 6, 1976: US03949410 (71 worldwide citation)

The practice of this disclosure obtains a monolithic structure useful for electrohydrodynamically synchronizing the formation of droplets in a jet stream exiting from a jet nozzle. The monolithic structure is primarily adaptable for ink jet printing. The jet nozzle structure provided by the practice ...

Howard H Taub, Peter H Wolf: Impulse jet head using etched silicon. Dataproducts Corporation, Spensley Horn Jubas & Lubitz, January 19, 1982: US04312008 (49 worldwide citation)

An improved impulse jet head structure utilizing etched silicon as the body of the structure. A silicon substrate is etched so as to form a nozzle groove, cavity, and ink supply groove. A layer of glass or other material is bonded to the top of the substrate so as to enclose the cavity and define, a ...

Howard H Taub, Gordon D Denler: Barrier structure for thermal ink-jet printheads. Hewlett Packard Company, William J Bethurum, December 27, 1988: US04794410 (38 worldwide citation)

A three-sided barrier structure (22), comprising three walls (24a-c), is provided in conjunction with a resistor (10) used in a thermal ink-jet printhead. Placement of the structure less than about 25 .mu.m from the resistor results in longer resistor life and an improvement in the static bubble pur ...

Si Ty Lam, Howard H Taub: Process for manufacturing thermal ink jet printheads having metal substrates and printheads manufactured thereby. Hewlett Packard Company, March 16, 1993: US05194877 (33 worldwide citation)

A method of manufacturing a thermal ink jet printhead wherein a reusable mandrel consisting of either a metal pattern on an insulating or semiconductive substrate or an insulating pattern on a metal substrate or metal layer is used in the process of electroforming a plurality of metal substrates use ...

William J West, Howard H Taub, Robert J Miller: Thermal-bonding process and apparatus. Hewlett Packard Company, William H F Howard, September 4, 1990: US04953287 (29 worldwide citation)

An orifice plate is thermally bonded to a thick film photopolymer spacer fabricated on a print head substrate using heat and compression. The compression is applied by pressurized gas to a pliable sheet covering the orifice plate and substrate assembly. Heat can be supplied through a vacuum chuck on ...

Howard H Taub, Gordon D Denler: Thermal ink-jet head structure with orifice offset from resistor. Hewlett Packard Company, William J Bethurum, December 27, 1988: US04794411 (27 worldwide citation)

Off-setting the orifice (20) from the resistor (10) in a thermal ink-jet printhead provides improved print quality by controlling misdirection of first drops (26), second and subsequent drops (28) in multidrop printing, and for satellite drop control.