1
Avi Tepman, Howard Grunes, Sasson Somekh, Dan Maydan: Staged-vacuum wafer processing system and method. Applied Materials, Philip A Dalton, February 16, 1993: US05186718 (472 worldwide citation)

A processing system for workpieces such as semiconductor wafers is disclosed which incorporates multiple, isolated vacuum stages between the cassette load lock station and the main vacuum processing chambers. A vacuum gradient is applied between the cassette load lock and the main processing chamber ...


2
Avi Tepman, Howard Grunes, Dana Andrews: Physical vapor deposition clamping mechanism and heater/cooler. Applied Materials, John A Frazzini, July 20, 1993: US05228501 (200 worldwide citation)

A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the ...


3
Howard Grunes, Avi Tepman, Robert Lowrance: Robot assembly. Applied Materials, Michael J Mallie, Naomi Obinata, September 5, 1995: US05447409 (77 worldwide citation)

A robot assembly, including a central hub, has two arms arranged for independent rotation about the hub. Two carriers, oriented 180.degree. apart from each other, are coupled to an end of each of the arms. A drive is provided for rotating the arms in opposite directions to extend one or the other of ...


4
Michael Rosenstein, Howard Grunes, Stephen Bruce Brodsky: Screwless shield assembly for vacuum processing chambers. Applied Materials, International Business Machines Corporation, Janis Biksa, November 25, 1997: US05690795 (57 worldwide citation)

A structure and method is described for securing an overspray shield in processing chambers in the wall sandwich of the chamber or using a dimensionally compliant floating spacer ring to elastically clamp the overspray shield in position in a vacuum substrate processing chamber without the use of re ...


5
John Forster, Aihua Chen, Howard Grunes, Robert B Lowrance, Ralf Hofmann, Zheng Xu, Fernand Dorleans: Slotted RF coil shield for plasma deposition system. Applied Materials, Fish & Richardson P C, June 9, 1998: US05763851 (45 worldwide citation)

A coil shield assembly for an RF field coil in a plasma processing system includes a first shield positioned inside the coil. The first shield has a central opening substantially surrounding a central space of a processing chamber in which the plasma is maintained. At least one slot is formed in the ...


6
Joe Stevens, Howard Grunes, Igor Kogan: High aspect ratio clamp ring. Applied Materials, Patterson & Streets L, September 22, 1998: US05810931 (26 worldwide citation)

The present invention provides a method and apparatus for protecting the edge of a substrate and securing the substrate to the support member during processing. The present invention preferably provides minimal contact with the substrate and provides improved edge exclusion. Support tabs extend inwa ...


7
Avi Tepman, Howard Grunes, Dana Andrews: Method of heating and cooling a wafer during semiconductor processing. Applied Materials, Birgit E Morris, January 16, 1996: US05484011 (24 worldwide citation)

A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the ...


8
Anantha Subramani, John C Forster, Bradley O Stimson, Sergio Edelstein, Howard Grunes, Avi Tepman, Zheng Xu: Recessed coil for generating a plasma. Applied Materials, Konrad Raynes & Victor, July 3, 2001: US06254746 (20 worldwide citation)

A recessed coil for a plasma chamber in a semiconductor fabrication system is provided. Recessing the coil reduces deposition of material onto the coil which in turn leads to a reduction in particulate matter shed by the coil onto the workpiece.


9
Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes, Avi Tepman, John Forster, Praburam Gopalraja: Coils for generating a plasma and for sputtering. Applied Materials, Konrad Raynes Victor & Mann, April 9, 2002: US06368469 (18 worldwide citation)

A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the wo ...


10
William McClintock, Robert B Lowrance, Howard Grunes: Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers. Applied Materials, Shirley L Kenyon & Kenyon Church, August 15, 2000: US06102164 (11 worldwide citation)

A robot assembly including multiple independently operable robot assemblies are provided for use in semiconductor wafer processing. The robot assembly includes independent co-axial upper and lower robot assemblies adapted to handle multiple objects. The upper robot is stacked above the lower robot a ...