1
Homayoun Talieh: Method and apparatus for electro-chemical mechanical deposition. Nutool, Pillsbury Madison & Sutro, January 23, 2001: US06176992 (272 worldwide citation)

The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surfa ...


2
Homayoun Talieh, Cyprian Emeka Uzoh: Method and apparatus for plating and polishing a semiconductor substrate. Nutool, Pillsbury Winthrop, December 11, 2001: US06328872 (119 worldwide citation)

The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used for plating/depositing the conducti ...


3
Homayoun Talieh, David Edwin Weldon: Linear polisher and method for semiconductor wafer planarization. OnTrak Systems, Brinks Hofer Gilson & Lione, December 2, 1997: US05692947 (99 worldwide citation)

A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is ...


4
Homayoun Talieh, David E Weldon, Boguslaw A Nagorski: Wafer polishing machine with fluid bearings. Ontrak Systems, Brinks Hofer Gilson & Lione, September 24, 1996: US05558568 (92 worldwide citation)

A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. The support includes multiple fluid bearings that support the polishing pad assembly on the support. These fluid bearings are arranged concen ...


5
Homayoun Talieh, Cyprian Uzoh, Bulent M Basol: Device providing electrical contact to the surface of a semiconductor workpiece during metal plating. NuTool, Crowell & Moring, December 24, 2002: US06497800 (85 worldwide citation)

Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first con ...


6
Cyprian Uzoh, Bulent Basol, Homayoun Talieh: Pad designs and structures for a versatile materials processing apparatus. NuTool, Crowell & Moring, July 2, 2002: US06413388 (84 worldwide citation)

An apparatus capable of assisting in controlling an electrolyte flow and an electric field distribution used for processing a substrate is provided. It includes a rigid member having a top surface of a predetermined shape and a bottom surface. The rigid member contains a plurality of channels, each ...


7
Bulent M Basol, Homayoun Talieh: Method and structure to improve reliability of copper interconnects. ASM Nutool, Knobbe Martens Olson & Bear, October 31, 2006: US07129165 (75 worldwide citation)

A method of forming a conductor structure on a surface of a wafer is provided. The surface of the wafer includes cavities separated by field regions. Initially, a barrier layer is deposited on the surface that includes cavities separated by field regions. A thin seed layer with a substantially unifo ...


8
Jalal Ashjaee, Boguslaw A Nagorski, Bulent M Basol, Homayoun Talieh, Cyprian Uzoh: Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing. NuTool, Crowell & Moring, November 19, 2002: US06482307 (74 worldwide citation)

Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical c ...


9
Cyprian Emeka Uzoh, Homayoun Talieh, Bulent Basol: Chip interconnect and packaging deposition methods and structures. Nutool, Pillsbury Winthrop, March 12, 2002: US06355153 (71 worldwide citation)

The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed ...


10
Cyprian Emeka Uzoh, Homayoun Talieh, Bulent Basol: Chip interconnect and packaging deposition methods and structures. ASM NuTool, Knobbe Martens Olson & Bear, December 12, 2006: US07147766 (70 worldwide citation)

The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplished by selectively removing portions of a seed ...