1
Edward Fuergut, Thomas Kalin, Holger Woerner, Carsten Von Koblinski: Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method. Infineon Technologies, Edell Shapiro & Finnan, April 10, 2007: US07202107 (66 worldwide citation)

A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top su ...


2
Jens Pohl, Bernd Roemer, Bernhard Schaetzler, Christian Stuempfl, Herman Vilsmeier, Holger Woerner, Bernhard Zuhr: Semiconductor module with a semiconductor stack, and methods for its production. Infineon Technologies, Edell Shapiro & Finnan, November 25, 2008: US07456495 (31 worldwide citation)

An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor compo ...


3
Michael Bauer, Edward Fuergut, Simon Jerebic, Holger Woerner: Semiconductor device with a wiring substrate and method for producing the same. Infineon Technologies, Edell Shapiro & Finnan, June 9, 2009: US07545047 (28 worldwide citation)

A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side ...


4
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic package and method for production. Infineon Technologies, Edell Shapiro & Finnan, October 2, 2007: US07276783 (26 worldwide citation)

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


5
Edward Fuergut, Thomas Kalin, Holger Woerner, Carsten Von Koblinski: Semiconductor structure with a plastic housing and separable carrier plate. Infineon Technologies, Edell Shapiro & Finnan, November 24, 2009: US07622733 (25 worldwide citation)

A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having ...


6
Michael Bauer, Edward Fuergut, Simon Jerebic, Holger Woerner: Method for producing through-contacts and a semiconductor component with through-contacts. Infineon Technologies, Edell Shapiro & Finnan, January 27, 2009: US07482198 (20 worldwide citation)

A method is described for producing through-contacts through a panel-shaped composite body including semiconductor chips and a plastic mass filled with conductive particles. The panel-shaped composite body is introduced between two high-voltage point electrodes. The point electrodes are oriented at ...


7
Edward Fuergut, Hermann Vilsmeier, Holger Woerner: Semiconductor device with semiconductor chip and rewiring layer and method for producing the same. Infineon Technologies, Edell Shapiro & Finnan, August 15, 2006: US07091595 (20 worldwide citation)

The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the h ...


8
Edward Fuergut, Bernd Goller, Robert Christian Hagen, Simon Jerebic, Jens Pohl, Peter Strobel, Holger Woerner: Smart card, smart card module, and a method for production of a smart card module. Infineon Technologies, Edell Shapiro & Finnan, August 18, 2009: US07575173 (17 worldwide citation)

A smart card for contact data transmission includes a card body and a smart card module which is fitted in the card body. The smart card module includes a semiconductor chip with an active upper surface, a plastic housing compound that surrounds the semiconductor chip and includes at least one surfa ...


9
Bernd Goller, Robert Christian Hagen, Christian Stuempfl, Stefan Wein, Holger Woerner: Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, June 7, 2005: US06902951 (17 worldwide citation)

An electronic device has, as a multichip module, two or more semiconductor chips that are integrated into a leadframe such that a placement side of the leadframe and the active top sides of the circuit chips are flush and have a common fine wiring plane. The leadframe is arranged as an expanded semi ...


10
Michael Bauer, Christian Birzer, Georg Ernst, Rainer Steiner, Hermann Vilsmeier, Holger Woerner: Semiconductor component with electromagnetic shielding device. Infineon Technologies, Dicke Billig & Czaja PLLC, March 7, 2006: US07009288 (12 worldwide citation)

A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas ...



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