1
Hiroichi Shinohara, Hirokazu Inoue, Yoichi Abe, Akira Kato, Hideo Suzuki, Kazuji Yamada, Masaaki Takahashi, Keiichirou Nakanishi: Capacitor-carrying semiconductor module. Hitachi, Antonelli Terry Stout & Kraus, January 5, 1993: US05177670 (160 worldwide citation)

Noise generated at high frequencies at the time of simultaneous switchings of logical circuits is reduced by lowering an inductance from LSI to a capacitor formed on a substrate. The capacitor is formed to ensure that an inductance from a bonding pad for the LSI loaded on the substrate to an electro ...


2
Hirokazu Inoue, Toyoshi Kawada, Yuji Sano: IC chip mounting structure and display device. Fujitsu Hitachi Plasma Display, Staas & Halsey, March 9, 2004: US06703702 (38 worldwide citation)

IC CHIP MOUNTING STRUCTURE has IC chips having protruding electrodes, a flexible printed circuit board having conductors connected to the protruding electrodes of the IC chips, and a protective plate attached to the flexible printed circuit board. The protective plate has openings to accommodate the ...


3
Hirokazu Inoue, Masahiro Takasaka, Koichi Watanabe, Takashi Hosokawa, Mamoru Sawahata: Method and apparatus for removing an electronic component from a board. Hitachi, Antonelli Terry Stout & Kraus, June 13, 1995: US05423931 (36 worldwide citation)

In a method of removing a component from a wiring board to which the component is attached by heat-softenable resin, the improvement is provided of, after softening of the resin by heat and removal of the component, removing residual resin remaining on the board at the location of the component by a ...


4
Akira Tanaka, Kazuji Yamada, Hirokazu Inoue, Hideo Arakawa, Masahide Okamoto: Semiconductor package and computer using it. Hitachi, Antonelli Terry Stout & Kraus, March 17, 1992: US05097318 (31 worldwide citation)

A cavity-down type package for a semiconductor device comprises an insulating base substrate on which the semiconductor device and another insulating cap substrate with plural outer connection terminals on its outer surface and with electrodes provided on conductive layers for electric conduction on ...


5
Hironori Kodama, Satoru Ogihara, Hideo Arakawa, Hirokazu Inoue, Yoshiyuki Yasutomi, Tadahiko Miyoshi: Installation structure of integrated circuit devices. Hitachi, Antonelli Terry Stout & Kraus, September 3, 1991: US05045922 (27 worldwide citation)

An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a therm ...


6
Takashi Hosokawa, Hirokazu Inoue, Mamoru Sawahata, Masaki Fukuoka: Electronic parts loaded module including thermal stress absorbing projecting electrodes. Hitachi, Antonelli Terry Stout & Kraus, June 6, 1995: US05422516 (26 worldwide citation)

An electronic parts loaded module comprises a circuit board having electronic parts connected thereto via a plurality of projecting electrodes, in which two or more of the plurality of projecting electrodes for connecting the electronic parts have a narrowed portion between one end adjacent to the b ...


7
Hirokazu Inoue, Toyoshi Kawada, Yuji Sano, Michitaka Ohsawa, Osamu Hirohashi: Display driver integrated circuit and flexible wiring board using a flat panel display metal chassis. Fujitsu Hitachi Plasma Display, Fuji Electric, Staas & Halsey, January 13, 2004: US06677664 (24 worldwide citation)

A low-cost display driver module that shortens the process for connecting an integrated circuit chip and a wiring pattern on a flexible wiring board and uses a metal chassis on a display panel as a radiator. In this display driver module, an integrated circuit chip with bump electrodes on it is join ...


8
Hirokazu Inoue, Ryuichi Saito, Mutsuhiro Mori, Yasutoshi Kurihara, Jin Onuki, Shin Kimura, Satoshi Shimada, Kazuhiro Suzuki, Yukio Kamita, Isao Kobayashi, Kazuji Yamada, Naohiro Momma: Semiconductor module. Hitachi, Hitachi Car Engineering, Antonelli Terry Stout & Kraus, March 5, 2002: US06353258 (23 worldwide citation)

A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on t ...


9
Akira Tanaka, Hirokazu Inoue, Kazuji Yamada, Kunio Miyazaki, Osamu Miura, Hideo Arakawa, Hiroshi Yokoyama, Yoshio Naganuma, Atsushi Morihara, Katsunori Ouchi: Semiconductor package and computer using the package. Hitachi, Antonelli Terry Stout & Kraus, March 10, 1992: US05095359 (19 worldwide citation)

A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which tra ...


10
Kunio Miyazaki, Yutaka Sugita, Akio Mukoh, Tadahiko Miyoshi, Osamu Miura, Akio Takahashi, Shunichi Numata, Satoru Ogihara, Kazuji Yamada, Hirokazu Inoue, Fumiyuki Kobayashi: Mounting substrate. Hitachi, Antonelli Terry Stout & Kraus, September 27, 1994: US05350886 (17 worldwide citation)

An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surfa ...