1
Hiroichi Shinohara, Hirokazu Inoue, Yoichi Abe, Akira Kato, Hideo Suzuki, Kazuji Yamada, Masaaki Takahashi, Keiichirou Nakanishi: Capacitor-carrying semiconductor module. Hitachi, Antonelli Terry Stout & Kraus, January 5, 1993: US05177670 (160 worldwide citation)

Noise generated at high frequencies at the time of simultaneous switchings of logical circuits is reduced by lowering an inductance from LSI to a capacitor formed on a substrate. The capacitor is formed to ensure that an inductance from a bonding pad for the LSI loaded on the substrate to an electro ...


2
Hiroichi Shinohara, Nobuyuki Ushifusa, Kousei Nagayama, Satoru Ogihara: Multilayer ceramic circuit board. Hitachi, Antonelli Terry & Wands, June 9, 1987: US04672152 (52 worldwide citation)

A ceramic insulating layer (2) for the multilayer ceramic circuit board (11) consists of 60 wt % of crystallized glass and 40 wt % of a filler such as silicon dioxide bonded by the crystallized glass, which consists of 6-15 wt % of lithium oxide, 70-90 wt % of silicon dioxide, 1-8 wt % of aluminum o ...


3
Satoru Ogihara, Shunichi Numata, Kunio Miyazaki, Takashi Yokoyama, Ken Takahashi, Tasao Soga, Kazuji Yamada, Hiroichi Shinohara, Hideo Suzuki: Semiconductor chip module. Hitachi, Antonelli Terry Stout & Kraus, November 13, 1990: US04970577 (49 worldwide citation)

A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion c ...


4
Nobuyuki Ushifusa, Hiroichi Shinohara, Kousei Nagayama, Satoru Ogihara, Tasao Soga: Ceramic multilayer circuit board and semiconductor module. Hitachi, Antonelli Terry & Wands, April 11, 1989: US04821142 (45 worldwide citation)

A ceramic multilayer circuit board comprising ceramic layers and wiring conductor layers laminated alternately, in which the ceramic layer has a thermal expansion coefficient lower than that of the wiring conductor and not lower than one half of that of the conductor layer and is formed from a glass ...


5
Keiichirou Nakanishi, Minoru Yamada, Masakazu Yamamoto, Satoru Ogihara, Hiroichi Shinohara, Hideo Suzuki: Chip carrier. Hitachi, Antonelli Terry Stout & Kraus, September 4, 1990: US04954877 (41 worldwide citation)

The present invention relates to a chip carrier, on which LSI chips are mounted and a chip carrier is disclosed, in which a region where power source throughholes are arranged and a region where signal throughholes are arranged are separated from each other and a coupling capacitor is formed only in ...


6
Hiroichi Shinohara, Hideo Suzuki, Satoru Ogihara, Hideo Arakawa: Ceramic laminated circuit substrate. Hitachi, Antonelli Terry Stout & Kraus, March 5, 1991: US04998159 (20 worldwide citation)

The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules. This substrate comprises a conductor layer and a plurality of ceramic insulating layers wherein ...


7
Nobuyuki Ushifusa, Satoru Ogihara, Kousei Nagayama, Hiroichi Shinohara, Gyozo Toda: Multilayered ceramic wiring circuit board and the method of producing the same. Hitachi, Antonelli Terry & Wands, April 5, 1988: US04736276 (13 worldwide citation)

Ceramic insulating substrate layers (1) for a multilayered ceramic wiring circuit board (3) consist essentially of crystals of mullite and sillimanite, non-crystalline silicon dioxide occupying the interstices between the crystals and magnesium oxide dissolved substantially in the crystals in solid ...


8
Hirokazu Inoue, Tomoji Oishi, Hiroichi Shinohara, Ken Takahashi, Tetsuo Nakazawa, Mitsuo Usami, Masaki Fukuoka: Semiconductor integrated circuit devices including means for reducing noise generated by high frequency internal circuitry. Hitachi, Antonelli Terry Stout & Kraus, September 12, 1995: US05449948 (12 worldwide citation)

Integrated circuit devices, chips and methods of making and operating them are disclosed. The devices are specially adapted for high frequency operation e.g. at or above 1 GHz. Inductive noise caused by switching at these frequencies--and which can interfere with switching--is inhibited by using a l ...


9
Akira Tanaka, Hiroichi Shinohara, Kazuji Yamada, Takao Ohba, Akira Yamagiwa, Hitoshi Yoshidome, Yuji Shirai, Toshio Hatada, Munehisa Kishimoto, Michiharu Honda: Semiconductor apparatus of module installing type. Hitachi, Antonelli Terry Stout & Kraus, May 24, 1994: US05315482 (9 worldwide citation)

A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hol ...


10
Hiroichi Shinohara, Hideo Suzuki, Satoru Ogihara: Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board. Hitachi, Antonelli Terry & Wands, August 15, 1989: US04858077 (6 worldwide citation)

A condenser-containing, ceramic multi-layer circuit board which comprises a plurality of layers of ceramic insulating material having circuit conductors, throughholes and condensers composed of ceramic dielectric condenser material having a higher dielectric constant than that of the ceramic insulat ...