1
Sugaya Yasuhiro, Komatsu Shingo, Hirano Koichi, Nakatani Seiichi, Matsuoka Yasuyuki, Asahi Toshiyuki, Yamashita Yoshihisa: Transfer material, method for producing the same and wiring substrate produced by using the same. Matsushita Electric, December 18, 2002: EP1267594-A2 (82 worldwide citation)

A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 ...


2
Nakatani Seiichi, Yamashita Yoshihisa, Ichiyanagi Takashi, Hirano Koichi: Magnetic substance striped array sheet, rfid magnetic sheet, electromagnetic shield sheet, and manufacturing methods for them. Matsushita Electric, May 1, 2008: JP2008-103691 (60 worldwide citation)

PROBLEM TO BE SOLVED: To provide a magnetic substance striped array sheet which has a needlelike magnetic substance excellently arrayed in a predetermined striped pattern, and also has high magnetic permeability and is thin and rich in flexibility.SOLUTION: A water-repellent layer 12 is formed on a ...


3
Yamashita Yoshihisa, Hirano Koichi, Shimizu Masanori, Nakatani Seiichi: Heat conduction wiring board for led lighting device, led lighting device using the same, and method of manufacturing them. Matsushita Electric, February 5, 2004: JP2004-039691 (21 worldwide citation)

PROBLEM TO BE SOLVED: To provide an LED lighting device which can be reduced in size by increasing its mounting density or improved in brightness as keeping unchanged in size.SOLUTION: A heat conduction wiring board 11 is used, which is equipped with an insulating layer 13 containing a resin composi ...


4
Sugaya Yasuhiro, Hirano Koichi, Nakatani Seiichi, Matsuoka Yasuyuki, Yuuhaku Satoru, Asahi Toshiyuki: Circuit component built-in module, radio device having the same, and method for producing the same. Matsushita Electric, June 27, 2001: EP1111674-A2 (20 worldwide citation)

A circuit component built-in module capable of mounting the circuit component with high density and having high heat releasing property and the high reliability. The circuit component built-in module 100 includes the insulating substrate 101 made of a first mixture 105 and a second mixture 106, wiri ...


5
Hirano Koichi, Karashima Seiji, Ichiryu Takashi, Tomita Yoshihiro: (Ja) 金属粒子分散組成物ならびにそれを用いたフリップチップ実装方法およびバンプ形成方法, (En) Composition having metal particles dispersed therein, and method for flip chip mounting and method for forming bump using the same. Matsushita Electric Industrial, Hirano Koichi, Karashima Seiji, Ichiryu Takashi, Tomita Yoshihiro, KAWAMIYA Osamu, September 14, 2006: WO/2006/095677 (20 worldwide citation)

(EN) Provided is a resin composition having metal particles dispersed therein which is suitably used in a method for the flip chip mounting or a method for forming a bump. The above composition comprises a first component (3a), a second component (3b), metal particles (1), (1’) and a convection addi ...


6
Yamashita Yoshihisa, Hirano Koichi, Nakatani Seiichi, Amami Kazuyoshi, Asahi Toshiyuki: Semiconductor device and its manufacturing method. Matsushita Electric, June 14, 2002: JP2002-170921 (18 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a plurality of semiconductor chips can be laminated and mounted and miniaturization and reduction of height are enabled as compared with the conventional case, and a method for manufacturing the device.SOLUTION: This semiconductor devic ...


7
Yamashita Yoshihisa, Hirano Koichi, Nakatani Seiichi, Matsuo Mitsuhiro: Method of manufacturing a thermally conductive substrate with leadframe and heat radiation plate. Matsushita Electric, December 5, 2001: EP1160861-A2 (16 worldwide citation)

A lead frame (100) is provided on a top surface of an electrically insulating sheet (101). A radiation plate (102) is attached to the bottom surface of the insulating sheet. By locating end portions of the radiation plate inside the periphery of the insulator sheet, it is possible to ensure a suffic ...


8
Sugaya Yasuhiro, Hirano Koichi, Nakatani Seiichi, Matsuoka Yasuyuki, Yuhaku Sei, Asahi Toshiyuki: Module with built-in circuit and its manufacturing method. Matsushita Electric, September 7, 2001: JP2001-244638 (13 worldwide citation)

PROBLEM TO BE SOLVED: To provide a reliable module with built-in circuit components that can mount circuit components with high density, and at the same time has a high heat radiation property.SOLUTION: A module 100 incorporating circuit components is composed of an electric insulating substrate 101 ...


9
Inoue Osamu, Kato Junichi, Nakatani Seiichi, Asahi Toshiyuki, Hirano Koichi: Magnetic device and manufacuring method thereof. Matsushita Electric, July 6, 2001: JP2001-185421 (10 worldwide citation)

PROBLEM TO BE SOLVED: To provide a magnetic device such as inductor, choke coil, and transformer which are suitable for high-current use of various kinds of electronic equipment. SOLUTION: The magnetic device comprises a composite magnetic member 1 including 50 to 70 volume % of metal magnetic powde ...


10
Hirano Koichi, Nakatani Seiichi: Semiconductor package and method for manufacturing the same. Matsushita Electric, April 7, 1999: EP0907205-A2 (7 worldwide citation)

A thermal conductive sheet 31 including at least 70-95 weight parts of inorganic filler and 5-30 weight parts of thermosetting resin composition and having flexibility in an uncured state is prepared. Through-holes 33 are formed in the thermal conductive sheet 31 and a conductive resin composition 3 ...