1
Hideo Arima, Kenji Takeda, Hideho Yamamura, Fumiyuki Kobayashi: Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module. Hitachi, Fay Sharpe Beall Fagan Minnich & McKee, January 25, 1994: US05281151 (132 worldwide citation)

A semiconductor chip carrier, an electronic module having the semiconductor chip carrier mounted therein, and an electronic device incorporating the electronic module. A semiconductor chip carrier comprises a multi-layer wiring substrate including a multi-layer ceramic board, and a thin film circuit ...


2
Shoichi Iwanaga, Nobuo Sato, Akira Ikegami, Tokio Isogai, Takanobu Noro, Hideo Arima: Gas detection device and method for detecting gas. Hitachi, Antonelli Terry & Wands, July 3, 1984: US04457161 (75 worldwide citation)

A gas detection device and a method for detecting a gas where gas information including concentrations of gas components in a mixed gas, concentration, presence of specific gas components and the like is detected by measuring, e.g., the output voltages of a plurality of gas sensors having different ...


3
Masayoshi Kaneyasu, Hideo Arima, Mitsuko Ito, Shoichi Iwanaga, Nobuo Sato, Takanobu Noro, Akira Ikagami, Tokio Isogai: Gas detecting apparatus. Hitachi, Antonelli Terry & Wands, January 20, 1987: US04638443 (45 worldwide citation)

A gas detecting apparatus incorporates a number of gas detecting elements which react with a variety of gases and exhibit gas sensitivities differing from one another in dependence on the gas species. The detection patterns obtained by quantitizing the detection outputs of the gas detecting elements ...


4
Hideo Arima, Kiyoshi Matsui, Kenji Takeda: Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit. Hitachi, Antonelli Terry Stout & Kraus, December 20, 1994: US05375042 (38 worldwide citation)

A semiconductor package and an electronic circuit board in which the semiconductor package is mounted on an external circuit board. The semiconductor package has a substrate assembly and a semiconductor mounted on the substrate, where the substrate assembly is composed of a thick film circuit in the ...


5
Hitoshi Yokono, Hideo Arima, Takashi Inoue, Naoya Kitamura, Haruhiko Matsuyama, Hitoshi Oka, Fumio Kataoka, Fusaji Shoji, Hideyasu Murooka, Masayuki Kyooi: Process for fabricating an interconnected multilayer board. Hitachi, Antonelli Terry Stout & Kraus, February 14, 1995: US05388328 (27 worldwide citation)

A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby for ...


6
Masayoshi Kaneyasu, Takanobu Noro, Hideo Arima, Mitsuko Ito, Shoichi Iwanaga, Nobuo Sato, Akira Ikegami, Tokio Isogai: Gas detecting apparatus. Hitachi, Antonelli Terry & Wands, April 29, 1986: US04586143 (23 worldwide citation)

A gas detecting apparatus is disclosed in which detection outputs from a plurality of semiconductor gas detecting elements different in gas detection characteristic from each other and previously-obtained characteristic values of the semiconductor gas detecting elements for a mixed gas are subjected ...


7
Hideo Arima, Masayoshi Kaneyasu, Mitsuko Ito: Gas detector. Hitachi, Antonelli Terry & Wands, November 6, 1984: US04481499 (21 worldwide citation)

A gas detector with a layer of gas sensing material comprising an oxide semiconductor, wherein at least one coating layer each of a p-type oxide semiconductor and an n-type oxide semiconductor is provided in a multi-layer arrangement on the surface of said layer of gas sensing material that contacts ...


8
Norio Saitou, Hideo Todokoro, Katsuhiro Kuroda, Satoru Fukuhara, Genya Matsuoka, Hideo Arima, Hitoshi Yokono, Takashi Inoue, Hidetaka Shigi: Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate. Hitachi, Fay Sharpe Beall Fagan Minnich & McKee, November 10, 1992: US05162240 (19 worldwide citation)

A thick and thin film hybrid multilayer wiring substrate includes an adjustment layer provided between a thick film circuit and a thin film circuit in order to adjust positions of the thick film circuit and the thin film circuit with high integration and large area of the thick and thin film hybrid ...


9
Hitoshi Yokono, Hideo Arima, Takashi Inoue, Naoya Kitamura, Haruhiko Matsuyama, Hitoshi Oka, Fumio Kataoka, Fusaji Shoji, Hideyasu Murooka, Masayuki Kyooi: Interconnected multilayer boards and fabrication processes thereof. Hitachi, Antonelli Terry Stout & Kraus, April 5, 1994: US05300735 (16 worldwide citation)

Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and me ...


10
Hiromi Tosaki, Hideo Arima, Teruo Mozume, Akira Ikegami, Tokio Isogai, Ichiro Tsubokawa: Thermistor composition. Hitachi, Craig and Antonelli, August 31, 1982: US04347166 (14 worldwide citation)

A thermistor composition comprises oxide powder of at least two of Mn, Co, and Ni, and an oxide powder of Ru as a noble metal.