1
Michael Bauer, Peter Strobel, Gerald Ofner, Edward F├╝rgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


2
Edward Fuergut, Hermann Vilsmeier, Holger Woerner: Semiconductor device with semiconductor chip and rewiring layer and method for producing the same. Infineon Technologies, Edell Shapiro & Finnan, August 15, 2006: US07091595 (20 worldwide citation)

The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the h ...


3
Michael Bauer, Christian Birzer, Georg Ernst, Rainer Steiner, Hermann Vilsmeier, Holger Woerner: Semiconductor component with electromagnetic shielding device. Infineon Technologies, Dicke Billig & Czaja PLLC, March 7, 2006: US07009288 (11 worldwide citation)

A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas ...


4
Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Christian Stuempfl, Horst Theuss, Hermann Vilsmeier: Semiconductor device having through contacts through a plastic housing composition and method for the production thereof. Infineon Technologies, Dicke Billig & Czaja PLLC, May 17, 2011: US07944061 (4 worldwide citation)

The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring ...


5
Edward Fuergut, Hermann Vilsmeier, Holger Woerner: Semiconductor device with semiconductor chip and rewiring layer and method for producing the same. Infineon Technologies, Edell Shapiro & Finnan, February 8, 2011: US07883993 (2 worldwide citation)

The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the h ...


6
Michael Bauer, Thomas Bemmerl, Edward Fuergut, Simon Jerebic, Hermann Vilsmeier: Panel and semiconductor device having a composite plate with semiconductor chips. Infineon Technologies, Dicke Billig & Czaja PLLC, May 11, 2010: US07713791 (1 worldwide citation)

The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top s ...


7
Edward Fuergut, Hermann Vilsmeier, Simon Jerebic, Michael Bauer: Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer. Dicke Billig & Czaja PLLC, November 12, 2013: US08580070 (1 worldwide citation)

The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early in ...


8
Michael Bauer, Edward Fuergut, Simon Jerebic, Hermann Vilsmeier: Integrated circuit component with a surface-mount housing. Infineon Technologies, Edell Shapiro & Finnan, February 16, 2010: US07663218 (1 worldwide citation)

A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces ar ...


9
Michael Bauer, Thomas Bemmerl, Markus Fink, Edward Fuergut, Horst Groeninger, Hermann Vilsmeier: Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof. Infineon Technologies, Dicke Billig & Czaja PLLC, May 4, 2010: US07709379

An electrical device having carbonized conductors and a method and a device for the production thereof is disclosed. The electrical device has electrical components having connections. Furthermore, there are situated between the electrical components regions made of plastic with conductors having ca ...


10
Ulrich Bachmaier, Michael Bauer, Robert Christian Hagen, Jens Pohl, Rainer Steiner, Peter Strobel, Hermann Vilsmeier, Holger Woerner, Bernhard Zuhr: Semiconductor component with plastic housing, and process for producing the same. Infineon Technologies, Edell Shapiro & Finnan, August 10, 2010: US07772105

A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connec ...



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