1
Raymond A Fillion, Robert J Wojnarowski, Michael Gdula, Herbert S Cole, Eric J Wildi, Wolfgang Daum: Method for fabricating an integrated circuit module. General Electric Company, Geoffrey H Krauss, October 11, 1994: US05353498 (693 worldwide citation)

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate ...


2
Raymond A Fillion, Robert J Woinarowski, Michael Gdula, Herbert S Cole, Eric J Wildi, Wolfgang Daum: Embedded substrate for integrated circuit modules. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, March 5, 1996: US05497033 (311 worldwide citation)

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate ...


3
Herbert S Cole, Raymond A Fillion, Bernard Gorowitz, Ronald F Kolc, Robert J Wojnarowski: Fabrication and structures of circuit modules with flexible interconnect layers. Martin Marietta Corporation, Geoffrey H Krauss, June 18, 1996: US05527741 (187 worldwide citation)

A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having c ...


4
Herbert S Cole: Transflective liquid crystal display. General Electric Company, Geoffrey H Krauss, James C Davis Jr, Marvin Snyder, August 16, 1983: US04398805 (175 worldwide citation)

A transflective liquid crystal display is viewable by either reflected or transmitted light. The display utilizes at least one display cell of the guest dichroic dye-host liquid crystal material type, wherein the molecules are substantially parallel to the cell walls and have a helical twist in the ...


5
Herbert S Cole Jr, Theresa A Sitnik Nieters, Robert J Wojnarowski, John H Lupinski: Reworkable high density interconnect structure incorporating a release layer. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, July 18, 1995: US05434751 (138 worldwide citation)

A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer ...


6
Herbert S Cole Jr, Lionel M Levinson, Yung S Liu, Theresa A Sitnik: Electroless deposition employing laser-patterned masking layer. General Electric Company, Marvin Snyder, James C Davis Jr, September 12, 1989: US04865873 (84 worldwide citation)

A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the ...


7
Herbert S Cole Jr, Yung S Liu: Multi-sublayer dielectric layers. General Electric Company, Marvin Snyder, James C Davis Jr, December 17, 1991: US05073814 (78 worldwide citation)

A dielectric layer comprising a plurality of sublayers of alternating composition can provide a reduced dielectric constant while providing the adhesion and laser drilling properties of a higher dielectric constant material. Such multi-sublayer dielectric layers may be formed in situ on a high densi ...


8
Siegfried Aftergut, Herbert S Cole, John E Bigelow, Alfred O Saupe: Multi-color liquid crystal display and system. General Electric Company, Geoffrey H Krauss, James C Davis Jr, Marvin Snyder, April 8, 1986: US04581608 (70 worldwide citation)

A multi-color liquid crystal display has a one-dimensional or two-dimensional array of at least one display cell, with a plurality of different liquid crystal host/guest dichroic dye compositions in each cell. Each of the different liquid crystal compositions may be provided within separate microcap ...


9
Raymond A Fillion, Herbert S Cole Jr: Reconstructable interconnect structure for electronic circuits. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, October 3, 1995: US05455459 (65 worldwide citation)

A reconstructible electrical circuit module includes a substrate, at least one electrical circuit component and an electrical interconnection structure. The electrical interconnection structure includes at least one multiple ply sequence stacked over the component and substrate in which the portion ...


10
Robert J Wojnarowski, Herbert S Cole, Theresa A Sitnik Nieters, Wolfgang Daum: Low Dielectric constant materials for high speed electronics. General Electric Company, Ann M Agosti, Marvin Snyder, November 19, 1996: US05576517 (57 worldwide citation)

An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and circuit chip. The porous polymer layer has at least one via therein aligned with at least one of the chip ...