1
Scott L Jacobs, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann: High performance integrated circuit packaging structure. International Business Machines Corporation, Steven J Meyers, Aziz M Ahsan, March 7, 1989: US04811082 (428 worldwide citation)

A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the co ...


2
Scott L Jacobs, Maurice T McMahon Jr, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann, Arthur R Zingher: Method of partitioning, testing and diagnosing a VLSI multichip package and associated structure. International Business Machines Corporation, Steven J Meyers, Yen S Yee, March 28, 1989: US04817093 (101 worldwide citation)

A self-contained method and structure for partitioning, testing and diagnosing a multi-chip packaging structure. The method comprises the steps of electronically inhibiting all chips in the multi-chip package except for the chip or chips under test, creating a signature of the chip or chips under te ...


3
Scott L Jacobs, Perwaiz Nihal, Burhan Ozmat, Henri D Schnurmann, Arthur R Zingher: Module for packaging semiconductor integrated circuit chips on a base substrate. International Business Machines Corporation, Aziz M Ahsan, Steven J Meyers, September 12, 1989: US04866507 (85 worldwide citation)

An integrated circuit chip packaging structure, preferably having a semiconductor base substrate, i.e., silicon or gallium arsenide, alternating insulation and conductive layers on the base structure, at least two conductive layers being patterned into thin film wiring (i.e., thin film copper of app ...


4
Henri D Schnurmann: Automatic testing of complex semiconductor components with test equipment having less channels than those required by the component under test. International Business Machines Corporation, Wesley DeBruin, September 7, 1982: US04348759 (43 worldwide citation)

A method and apparatus for testing large or very large scale integrated circuit packages is described. The testing equipment required for testing such packages is assumed to lack the number of channels necessary to connect one channel to each input/output of the unit under test. A computer program c ...


5
Robert M Peters, Henri D Schnurmann, Louis J Vidunas: Automatically testing a plurality of memory arrays on selected memory array testers. International Business Machines, Robert J Haase, August 12, 1986: US04606025 (33 worldwide citation)

A system for automatically testing a plurality of memory arrays on selected memory array testers includes an interactive data entry device for entering array test specifications including characterizing information, DC testing parameters, AC testing parameters and AC test pattern choices for the arr ...


6
Edward P Hsieh, Maurice T McMahon, Henri D Schnurmann: Diagnostics of a board containing a plurality of hybrid electronic components. International Business Machines Corporation, John D Crane, Donald M Boles, October 16, 1990: US04963824 (26 worldwide citation)

A method and circuitry for testing in situ the components mounted on a circuit board. First, a component is removed from the board. A testing circuit is then installed in place of the removed component. The testing circuit allows test patterns to be applied to a selected component on the board from ...


7
Anil K Chinthakindi, Henri D Schnurmann: Elastomeric CMOS based micro electromechanical varactor. International Business Machines Corporation, Joseph P Abate Esq, September 4, 2007: US07265019 (12 worldwide citation)

A micro electro-mechanical system (MEMS) variable capacitor is described, wherein movable comb electrodes of opposing polarity are fabricated simultaneously on the same substrate and are independently actuated. The electrodes are formed in an interdigitated fashion to maximize capacitance. The MEMS ...


8
Anil K Chinthakindi, Henri D Schnurmann: Elastomeric cmos based micro electromechanical varactor. International Business Machines Corporation, International Business Machines Corporation, Dept 18g, January 5, 2006: US20060003482-A1

A micro electro-mechanical system (MEMS) variable capacitor is described, wherein movable comb electrodes of opposing polarity are fabricated simultaneously on the same substrate and are independently actuated. The electrodes are formed in an interdigitated fashion to maximize capacitance. The MEMS ...