1
Andrew T Hunt, Tzyy Jiuan Hwang, Helmut G Hornis, Wen Yi Lin: Formation of thin film capacitors. MicroCoating Technologies, March 27, 2001: US06207522 (79 worldwide citation)

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


2
Andrew T Hunt, Wen Yi Lin, Tzyy Jiuan Hwang, Michelle Hendrick, Helmut G Hornis: Formation of thin film capacitors. MicroCoating Technologies, Wayne E Nacker, Alfred H Muratori, S Matthew Cairns, August 13, 2002: US06433993 (61 worldwide citation)

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


3
Andrew T Hunt, Helmut G Hornis: Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions. Microcoating Technologies, Foley Hoag & Eliot, December 7, 1999: US05997956 (58 worldwide citation)

A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coati ...


4
Andrew T Hunt, Tzyy Jiuan Hwang, Helmut G Hornis, Wen Yi Lin: Formation of thin film capacitors. Shipley Company L L C, S Matthew Cairns, April 27, 2004: US06728092 (49 worldwide citation)

Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, ...


5
Andrew T Hunt, Tzyy Jiuan Hwang, Helmut G Hornis, Hong Shao, Joe Thomas, Wen Yi Lin, Shara S Shoup, Henry A Luten, John Eric McEntyre: Precursor solution compositions for electronic devices using CCVD. Morton International Incorporated, February 27, 2001: US06193911 (20 worldwide citation)

Precursor solutions are provided to produce thin film resistive materials by combustion chemical vapor deposition (CCVD) or controlled atmosphere combustion chemical vapor deposition (CACCVD). The resistive material may be a mixture of a zero valence metal and a dielectric material, or the resistive ...


6
Andrew T Hunt, Helmut G Hornis: Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions. Microcoating Technologies, Edward J Foley Hoag & Eliot Kelly, October 17, 2000: US06132653 (15 worldwide citation)

A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coati ...


7
Andrew T Hunt, Helmut G Hornis: Methods of chemical vapor deposition and powder formation. Micro Coating Technologies, Alfred H Muratori, Wayne E Nacker, Ed Kelly, September 21, 2004: US06793975 (3 worldwide citation)

A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coati ...


8
Andrew T Hunt, Helmut G Hornis: Chemical vapor deposition and powder formation using thermal spray. Wayne E Nacker Esq, Microcoating Technologies, November 15, 2001: US20010039919-A1

A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coati ...


9
Andrew T Hunt, Helmut G Hornis: Chemical vapor deposition and powder formation using thermal spray. Alfred H Muratori, Microcoating Technologies, January 27, 2005: US20050019551-A1

A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coati ...


10
Andrew T Hunt, Helmut G Hornis: Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions. Wayne E Nacker Esq, Microcoating Technologies, February 7, 2002: US20020015797-A1

A method for chemical vapor deposition using a very fine atomization or vaporization of a reagent containing liquid or liquid-like fluid near its supercritical temperature, where the resulting atomized or vaporized solution is entered into a flame or a plasma torch, and a powder is formed or a coati ...