1
Je Kyun Park, Hee Jin Lee: Breath alcohol analyzer using a biosensor. Goldstar, Finnegan Henderson Farabow Garrett & Dunner L, November 5, 1996: US05571395 (238 worldwide citation)

A biosensor for measuring alcohol concentration includes an insulating substrate and an amperometric device formed on the insulation substrate, having a plurality of conductive lines and connective pads and a plurality of electrodes. An enzyme immobilized layer is formed on one of the plurality of e ...


2
Je Kyun Park, Hee Jin Lee: Biosensor for measuring gas and the manufacturing method thereof. Goldstar, Oppenheimer Poms Smith, August 12, 1997: US05656142 (24 worldwide citation)

A biosensor for measuring gas-phase organic chemicals rapidly and accurately. The biosensor includes a thick film electrochemical device having an insulating substrate, electrodes formed on the substrate, connecting pads for the electrodes and an insulating layer, and a responsive membrane formed on ...


3
Hee Jin Lee: Method of transferring data between networks. Samsung Electronics, Sughrue Mion PLLC, April 1, 2003: US06542506 (11 worldwide citation)

A method of transferring data between networks includes storing a connection path set between predetermined data from a first network and a predetermined address in a second network during initial connection between the first and second networks, and transferring the predetermined data from the firs ...


4
Joong hyun Baek, Hee jin Lee, Jin kwon Bae: Semiconductor module. Samsung Electronics, Harness Dickey & Pierce, May 22, 2012: US08184439 (7 worldwide citation)

A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat c ...


5
Hee jin Lee: Data transfer method for matching upper protocal layer to high speed serial bus. Samsung Electronics, Sughrue Mion PLLC, March 2, 2004: US06701371 (5 worldwide citation)

A data transfer method for matching an upper protocol layer to a high speed serial bus. In the data transfer method, it is determined whether transfer data to be transferred from the upper protocol layer to the high speed serial bus, is stream data that is transferred to a predetermined node which t ...


6
Joong Hyun Baek, Hee Jin Lee: Wafer stacked package waving bertical heat emission path and method of fabricating the same. Samsung Electronics, Volentine & Whitt PLLC, November 13, 2012: US08310046 (2 worldwide citation)

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole f ...


7
Hee Sung Choi, Bae Kyun Kim, Mi Hee Park, Hee Jin Lee, Sung Soo Park, Dong Hyun Cho: Optical component and method of manufacturing the same. Samsung Electro-Mechanics, June 15, 2010: US07738194 (2 worldwide citation)

An optical component includes a lens holder including a first electrode, an insulating structure formed on the first electrode and having a through hole provided as an optical path, and at least one second electrode formed inside the insulating structure to encompass the through hole, and at least o ...


8
Joong Hyun Baek, Hee Jin Lee: Wafer stacked package waving bertical heat emission path and method of fabricating the same. Samsung Electronics, Volentine & Whitt PLLC, November 1, 2011: US08049329 (2 worldwide citation)

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole f ...


9
Joong Hyun Baek, Hee Jin Lee: Wafer stacked package having vertical heat emission path and method of fabricating the same. Samsung Electronics, Volentine & Whitt PLLC, December 1, 2009: US07626261 (2 worldwide citation)

A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole f ...


10
Dae Ho Lee, Hyo Soon Kang, Seok Hong Kwon, Tae Young Yoon, Hee Jin Lee: Stack semiconductor package. Samsung Electronics, Renaissance IP Law Group, October 11, 2016: US09466593 (1 worldwide citation)

A stack semiconductor package includes a first semiconductor package having a first package substrate and a first semiconductor chip mounted on the first package substrate. The first semiconductor chip includes first chip pads arranged along a side portion thereof. The stack semiconductor package in ...