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Eb Eshun
BOOTH ROGER A JR, COOLBAUGH DOUGLAS D, ESHUN EBENEZER E, HE ZHONG XIANG: [en] Interdigitated vertical parallel capacitor. IBM, May 23, 2012: GB2485693-A

[en] An interdigitated structure may include at least one first metal line, at least one second metal line parallel to the at least one first metal line and separated from the at least one first metal line, and a third metal line contacting ends of the at least one first metal line and separated fro ...


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Eb Eshun
Coolbaugh Douglas D, Eshun Ebenezer E, Gambino Jeffrey P, He Zhong Xiang, Ramachandran Vidhya: Metal-insulator-metal capacitor and method of fabrication. International Business Machines Corporation, August 25, 2006: KR1020067005670

A method and structure for a MIM capacitor, the structure including: an electronic device, comprising: an interlevel dielectric layer formed on a semiconductor substrate; a copper bottom electrode formed in the interlevel dielectric layer, a top surface of the bottom electrode co-planer with a top s ...


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Eb Eshun
Coolbaugh Douglas D, Eshun Ebenezer E, Feilchenfeld Natalie, Gautsch Michael L, He Zhong Xiang, Moon Matthew D, Ramachandran Vidhya, Waterhouse Barbara: Formation of metal-insulator metal capacitor simultaneously with aluminum metal wiring level using a hardmask. International Business Machines Corporation, March 12, 2007: KR1020067025149

Disclosed is a method of fabricating a metal-insulator-metal (MIM) capacitor. In this method, a dielectric layer (102, 106) is formed above a lower conductor layer (100) and an upper conductor layer (104, 108) is formed above the dielectric layer. The invention then forms an etch stop layer (200) ab ...


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Eb Eshun
He Zhong Xiang, Eshun Ebenezer E, Douglas D Coolbaugh, Rassel Robert Mark: Device, and method (mim capacitor and its manufacturing method). Internatl Business Mach Corp &Lt IBM&Gt, January 10, 2008: JP2008-004939

PROBLEM TO BE SOLVED: To provide an MIM capacitor device and a method for manufacturing it.SOLUTION: This device includes: an upper plate which comprises one or more conductive layers and has an upper surface, a lower surface and a side wall; a spreader plate which comprises one or more conductive l ...


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Eb Eshun
Booth Jr Roger A, Coolbaugh Douglas D, Eshun Ebenezer E, He Zhong xiang: Interdigitated vertical parallel capacitor. IBM, feng xun, May 23, 2012: CN201080036668

An interdigitated structure may include at least one first metal line, at least one second metal line parallel to the at least one first metal line and separated from the at least one first metal line, and a third metal line contacting ends of the at least one first metal line and separated from the ...


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