1
Kaname Ozawa, Hayato Okuda, Tetsuya Hiraoka, Mitsutaka Sato, Yuji Akashi, Akira Okada, Masahiko Harayama: Semiconductor device. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, November 13, 2001: US06316838 (389 worldwide citation)

A semiconductor device includes a substrate provided with a plurality of leads, a face-down semiconductor element provided on one surface of the substrate, a first stacked semiconductor element and a second stacked semiconductor element provided on another surface of the substrate and connected to t ...


2
Kaname Ozawa, Hayato Okuda, Ryuji Nomoto, Yuji Akashi, Katsuro Hiraiwa: Semiconductor device and method for producing the same. Fujitsu, Armstrong Westerman Hattori McLeland & Naughton, April 10, 2001: US06215182 (60 worldwide citation)

A semiconductor device includes the first through third semiconductor devices which are stacked on a substrate and the first through third wires for connecting the semiconductor elements and the substrate. The first wires serve to connect electrodes of the first semiconductor element positioned uppe ...


3
Katsuhito Kikuma, Mitsutaka Ikeda, Yoshihiro Tsukidate, Yuji Akashi, Kaname Ozawa, Akira Takashima, Tadashi Uno, Takao Nishimura, Fumihiko Ando, Hiroshi Onodera, Hayato Okuda: Stacked semiconductor device and method of producing the same. Fujitsu, Armstrong Westerman & Hattori, September 16, 2003: US06621169 (58 worldwide citation)

In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first sem ...


4
Seiji Odan, Hayato Okuda, Kuniaki Ishigami: Door structure of motor vehicle. Mazda Motor Corporation, Martin Fleit, February 2, 1999: US05865496 (21 worldwide citation)

A door structure of a motor vehicle has an inner panel and an outer panel. The door structure includes an impact load absorber member, provided at an outer panel side of the door, for absorbing and reducing a side collision impact load acting on a passenger by contact with the passenger. An opening ...


5
Hayato Okuda, Hiroyuki Matsuo: Information processing apparatus and phase control method. Fujitsu, Fujitsu Patent Center, September 21, 2010: US07800421 (1 worldwide citation)

An apparatus includes plural combinations of a clock supplier and a clock supply destination supplied with a clock from the clock supplier. The clock supply destination includes a return route through which the clock supply destination returns a clock to a corresponding clock supplier. The clock sup ...


6
Kazushi Yamamoto, Yutaka Ozaki, Hayato Okuda: Helicopter satellite communication system, helicopter-mounted communication apparatus, terrestrial station communication apparatus, communication method, and non-transitory computer-readable recording medium storing computer program. Mitsubishi Electric Corporation, Oblon McClelland Maier & Neustadt L, April 19, 2016: US09319128

A helicopter-mounted communication apparatus encodes video data at a compression rate based on a percentage of time a transmission beam is blocked by rotor blades. When a number of video packets is less than a specified number, the helicopter-mounted communication apparatus inserts null packets to k ...


7
Katsuhito Kikuma, Mitsutaka Ikeda, Yoshihiro Tsukidate, Yuji Akashi, Kaname Ozawa, Akira Takashima, Tadashi Uno, Takao Nishimura, Fumihiko Ando, Hiroshi Onodera, Hayato Okuda: Stacked semiconductor device and method of producing the same. Fujitsu, Armstrong Westerman & Hattori, March 7, 2002: US20020027295-A1

In a stacked semiconductor device which has a plurality of semiconductor chips of desired sizes stacked as one package, a first semiconductor chip is mounted on a flexible printed wiring board provided with external connecting terminals. A printed circuit board is placed and mounted on the first sem ...


8
Hayato Okuda, Hiroyuki Matsuo: Information processing apparatus and phase control method. Fujitsu, Katten Muchin Rosenman, May 29, 2008: US20080122503-A1

An apparatus includes plural combinations of a clock supplier and a clock supply destination supplied with a clock from the clock supplier. The clock supply destination includes a return route through which the clock supply destination returns a clock to a corresponding clock supplier. The clock sup ...


9
Hayato OKUDA: Transmission apparatus and control method. Fujitsu, September 29, 2011: US20110239034-A1

There is provided a transmission apparatus including: a clock generator; a first circuit including first data processors to process input data based on a first input clock, the first data processors electrically connected in series each transmitting data processed thereby and the first input clock t ...


10
Hayato OKUDA, Yasunori Kawaoka, Akira Takashima: Ball grid array semiconductor device and its manufacture. Fujitsu Semiconductor, May 3, 2012: US20120104606-A1

A semiconductor device includes: stacked semiconductor chips having respective input/output pads on surfaces thereof; a lower resin body molding the lower semiconductor chip and having a surface coplanar with the lower chip; an upper resin body molding the upper chip and coupled with the first resin ...