1
Hashimoto Nobuaki: Semiconductor device and manufacturing method thereof, circuit board and flexible board. Seiko Epson Corporation, August 21, 1999: TW367570 (48 worldwide citation)

The invention provides the semiconductor device and manufacturing method for quality assurance, easy-to-use and one-time welding between circuit board and semiconductor chip electrode and the circuit board and flexible board. There is clearance holding means on the surface of junction of electrode o ...


2
Hashimoto Nobuaki: Electronic device, its arrangement and method of manufacturing the same. Seiko Epson, December 27, 1995: EP0689245-A2 (26 worldwide citation)

An object of the present invention is to provide a leadless package type electronic device, the cost and the size of which can be reduced and which exhibits excellent reliability, an electronic device arrangement for manufacturing the electronic devices, and a method therefor. The electronic device ...


3
Hashimoto Nobuaki: Semiconductor chip and its manufacture, semiconductor device, computer, circuit board and electronic equipment. Seiko Epson, March 16, 2001: JP2001-068618 (22 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor chip, which can be laminated with no interposer in between and the laminated semiconductor chip is connected electrically regardless of the size thereof, and a method for manufacturing it, a semiconductor device, a computer, a circuit board and an ele ...


4
Hashimoto Nobuaki: Electronic component, semiconductor device, manufacturing method therefor, circuit board and electronic equipment. Seiko Epson, May 19, 1999: EP0917195-A1 (10 worldwide citation)

The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconductor chip (12) and the solder ball (20), a stress reliev ...


5
Hashimoto Nobuaki: Semiconductor device and circuit board having the same mounted thereon. Seiko Epson, May 6, 1999: EP0913866-A1 (10 worldwide citation)

An integrated type semiconductor device that is capable of reducing cost or improving the reliability of connecting semiconductor chips together or chips to a circuit board. One embodiment of such an integrated type semiconductor device comprises a first semiconductor device (10) having a semiconduc ...


6
Hashimoto Nobuaki, Miyauchi Chuuji: Printing-plate mounting-position instruction system. Tokyo Kikai Seisakusho, May 24, 2000: EP1002646-A1 (9 worldwide citation)

A printing-plate mounting-position instruction system instructs a worker where to mount a plurality of printing plates (P) in a rotary printing press. The system includes a controller (1), a reader (2), a judging device (3), and a display device (4). The controller (1) creates assignment information ...


7
Hashimoto Nobuaki: Semiconductor device, its manufacture, circuit substrate, and electronics. Seiko Epson, November 2, 2000: JP2000-307055 (9 worldwide citation)

PROBLEM TO BE SOLVED: To achieve rework such as the planar expansion of a substrate and the replacement of a semiconductor chip after a semiconductor device is completed by maintaining the substrate where the semiconductor chips are arranged while being piled up in a flex state by a detachable conne ...


8
Ito Haruki, Hashimoto Nobuaki: Electronic component, circuit board, electronic apparatus, and method for manufacturing the electronic component. Seiko Epson, March 15, 2006: EP1635457-A2 (8 worldwide citation)

An electronic component (1) includes: a semiconductor substrate (10) having a first surface (10A) and a second surface (10B) opposing to the first surface (10A); a trans-substrate conductive plug (12) that penetrates the semiconductor substrate (10) from the first surface (10A) to the second surface ...


9
Hashimoto Nobuaki: Semiconductor device and manufacturing method thereof, semiconductor module, circuit board as well as electronic equipment. Seiko Epson, March 17, 2005: JP2005-072626 (7 worldwide citation)

PROBLEM TO BE SOLVED: To provide a semiconductor device, of which the reliability and productivity have been enhanced, by forming a plurality of bonding sections side by side in a width direction of a tape carrier and by adhering a plurality of semiconductor devices, and to provide a manufacturing m ...


10
Hashimoto Nobuaki: Optical device and its manufacturing method, optical module, and circuit board and electronic instrument. Seiko Epson, July 11, 2003: JP2003-197656 (7 worldwide citation)

PROBLEM TO BE SOLVED: To provide a high quality optical device and its manufacturing method, an optical module, and a circuit board and an electronic instrument.SOLUTION: A plurality of covers 30 each including an optically transparent section are mounted on a board 10 on which a plurality of optica ...