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Nakayama Koji, Mougi Kenji, Shiramatsu Eiji, Iwamoto Kazushige, Ishiwata Shinichi, Hasebe Morikuni: Semiconductor wafer-securing adhesive tape.. Furukawa Electric, December 30, 1992: EP0520515-A2 (14 worldwide citation)

There is disclosed a semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a specified styrene/ethylene/butene/styrene (SEBS) ...


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Hasebe Morikuni, Nagai Hiroshi, Fukuda Teruo: Method of mitigating sulfide trees in polyolefin insulated conductors. The Furukawa Electric, May 16, 1972: US3663742 (4 worldwide citation)

In an electric cable provided with a plastic sheath and an insulating layer consisting of polyolefin series resin applied directly or with the aid of other insulating layer on the copper conductor, polyolefin-series resin insulated electric cable provided in a desired position with a sulfide-capture ...


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Hasebe Morikuni, Nagai Hiroshi, Fukuda Teruo: Polyolefin insulated electric cable. Furukawa Electric, October 11, 1972: GB1292389-A

1292389 Electric cables FURUKAWA ELECTRIC CO Ltd 6 Oct 1970 [6 Oct 1969] 47444/70 Heading H1A A cable comprises a conductor, a polyolefin insulation, a sulphide capture layer and a plastics sheath. The sulphide capture layer consists of a polyolefin containing at least one powdery metal, metal salt, ...


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Nishiguchi Masami, Oishi Yoshiaki, Hasebe Morikuni, Sado Tatsushi: Modified polycarbonate. Furukawa Electric The, Nippon Soda, March 23, 1993: JP1993-070582

PURPOSE: To improve transparency and heat resistance by reacting biphenol bischloroformate with a bisphenol. CONSTITUTION: A modified polycarbonate of formula III (wherein R1 and R2 are each H, lower alkyl, or trifluoromethyl provided that they may combine with each other to form a ring; and n is a ...


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Nakayama Hiroshi, Mochiki Kenji, Shiramatsu Eiji, Ishiwatari Shinichi, Iwamoto Kazushige, Hasebe Morikuni: Self-adhesive tape for fixing semiconductor wafer. Furukawa Electric The, April 20, 1993: JP1993-098220

PURPOSE: To provide the title tape which is free from rupture due to degradation of ite substrate film while retaining rubber elasticity (flexibility) even after exposure to a radiation and thus enables a large and uniform expansion of distances between devices when stretched after the exposure. CON ...


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Nakayama Hiroshi, Mochiki Kenji, Shiramatsu Eiji, Ishiwatari Shinichi, Iwamoto Kazushige, Hasebe Morikuni: Tacky tape for fixing semiconductor wafer. Furukawa Electric The, June 15, 1993: JP1993-148457

PURPOSE: To obtain the subject film capable of extremely and uniformly enlarging intervals between elements by providing a urethane-amide-based polymer film layer with an adhesive layer, a tacky agent layer and a transfer preventing layer to give a laminate film as a substrate film and equipping the ...


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Nakayama Hiroshi, Mochiki Kenji, Shiramatsu Eiji, Ishiwatari Shinichi, Iwamoto Kazushige, Hasebe Morikuni: Pressure-sensitive adhesive tape for fixation of semiconductor wafer. Furukawa Electric The, June 15, 1993: JP1993-148462

PURPOSE: To obtain the subject tape capable of remarkably widening the space between devices by making a radiation-curing pressure-sensitive adhesive layer on one side of a base film in which a pressure-sensitive adhesive-application layer is formed through an adhesive layer on a polyamide-polyether ...