1
Kumaraswamy Jayaraj, Thomas E Noll, Harry F Lockwood: Chip packaging technique. Foster Miller, November 20, 2001: US06320257 (44 worldwide citation)

A hermetically sealed package for at least one semiconductor chip is provided which is formed of a substrate having electrical interconnects thereon to which the semiconductor chips are selectively bonded, and a lid which preferably functions as a heat sink, with a hermetic seal being formed around ...


2
Craig A Armiento, Chirravuri Jagannath, Marvin J Tabasky, Thomas W Fitzgerald, Harry F Lockwood, Paul O Haugsjaa, Mark A Rothman, Vincent J Barry, Margaret B Stern: Method and device for passive alignment of diode lasers and optical fibers. GTE Laboratories Incorporated, Victor F Lohmann III, November 10, 1992: US05163108 (36 worldwide citation)

A method of passively aligning optical receiving elements such as fibers to the active elements of a light generating chip includes the steps of forming two front and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel ha ...


3
Ivan Ladany, Michael Ettenberg, Harry F Lockwood, Henry Kressel: Half wave protection layers on injection lasers. RCA Corporation, H Christoffersen, D S Cohen, December 11, 1979: US04178564 (34 worldwide citation)

A body of semiconductor material of an injection laser device, capable of operating at a power level up to a few milliwatts per micrometer of emitting width, has two opposed facet surfaces. On at least one of the facet surfaces is a protection layer of an insulating material having an optical thickn ...


4
Craig A Armiento, Chirravuri Jagannath, Marvin J Tabasky, Thomas W Fitzgerald, Harry F Lockwood, Paul O Haugsjaa, Mark A Rothman, Vincent J Barry, Margaret B Stern: Method and device for passive alignment of diode lasers and optical fibers. GTE Laboratories Incorporated, Victor F Lohmann III, January 7, 1992: US05077878 (30 worldwide citation)

A method of passively aligning optical receiving elements such as fibers to the active elements of a light generating chip includes the steps of forming two front and one side pedestal structures on the surface of a substrate body, defining a vertical sidewall of the chip to form a mating channel ha ...


5
Peter S Zory, Frederick W Scholl, Harry F Lockwood: Mounting arrangement for semiconductor optoelectronic devices. Optical Information Systems, Arthur L Plevy, September 7, 1982: US04347655 (26 worldwide citation)

A new package for semiconductor optoelectronic devices is disclosed, which comprises a novel geometrical configuration and provides plug-in capability. The package configuration provides a convenient means for supplying electrical signals to or from the device(s) within the package while maintaining ...


6
Harry F Lockwood: Field emission device with microchannel gain element. Cesari and McKenna, March 17, 1998: US05729244 (19 worldwide citation)

A field emission device with microchannel gain element provides a plurality of field emission or "cold" cathodes formed generally into an array. The cold cathodes are typically modulated by a grid having a driving voltage. A microchannel gain element is located adjacent the array of cathodes and pro ...


7
Harry F Lockwood: Field emission device with microchannel gain element. February 18, 2003: US06522061 (17 worldwide citation)

A field emission device with a micro-channel gain element included a plurality of field emission or “cold” cathodes (


8
Peter S Zory, Frederick W Scholl, Harry F Lockwood: Semiconductor optoelectronic device package. Exxon Research & Engineering Co, December 16, 1980: US04240098 (9 worldwide citation)

A new package for semiconductor optoelectronic devices is disclosed, which comprises a novel geometrical configuration and provides plug-in capability. The package configuration provides a convenient means for supplying electrical signals to or from the device(s) within the package while maintaining ...


9
Harry F Lockwood, Thomas F McGee: Microwave curing of photoresist films. Exxon Research & Engineering Co, David W Collins, Paul E Purwin, January 6, 1981: US04243744 (7 worldwide citation)

Microwave curing of photoresist films employed in processing semiconductor wafers provides an alternative to conventional drying techniques. The time of curing may be reduced from about 20 to 25 minutes required for conventional air drying to about 5 minutes employing microwave curing. Further, the ...


10
David R Beaulieu, Harry F Lockwood, Anton S Tremsin: Microchannel amplifier with tailored pore resistance. Arradiance, Kurt Rauschenbach, Rauschenbach Patent Law Group, August 5, 2008: US07408142 (3 worldwide citation)

A microchannel amplifier includes an insulating substrate that defines at least one microchannel pore through the substrate from an input surface to an output surface. A conductive layer is formed on an outer surface of the at least one microchannel pore that has a non-uniform resistance as a functi ...