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Katherina Babich
Deok kee Kim, Kenneth T Settlemyer Jr, Kangguo Cheng, Ramachandra Divakaruni, Carl J Radens, Dirk Pfeiffer, Timothy Dalton, Katherina Babich, Arpan P Mahorowala, Harald Okorn Schmidt: Methods and structures for protecting one area while processing another area on a chip. International Business Machines Corporation, Whitman Curtis Christofferson & Cook PC, Joseph P Abate, March 3, 2009: US07497959 (4 worldwide citation)

Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided whi ...


2
Katherina Babich
Deok kee Kim, Kenneth T Settlemyer, Kangguo Cheng, Ramachandra Divakaruni, Carl J Radens, Dirk Pfeiffer, Thimothy Dalton, Katherina Babich, Arpan P Mahorowala, Harald Okorn Schmidt: Methods and structures for protecting one area while processing another area on a chip. Whitham Curtis & Christofferson PC, October 23, 2008: US20080261128-A1

Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided whi ...


3
Katherina Babich
Deok kee Kim, Kenneth T Settlemyer, Kangguo Cheng, Ramachandra Divakaruni, Carl J Radens, Dirk Pfeiffer, Timothy Dalton, Katherina Babich, Arpan P Mahorowala, Harald Okorn Schmidt: Methods and structures for protecting one area while processing another area on a chip. International Business Machines Corporation, Whitham Curtis & Christofferson PC, November 17, 2005: US20050255386-A1

Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided whi ...


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Harald Okorn Schmidt, Franz Kumning, Rainer Obweger, Thomas Wirnsberger: Method and apparatus for surface treatment using inorganic acid and ozone. Lam Research, Young & Thompson, April 29, 2014: US08709165 (1 worldwide citation)

Improved removal of ion-implanted photoresist in a single wafer front-end wet processing station is achieved by dissolving gaseous ozone into relatively cool inorganic acid, dispensing the acid ozone mixture onto a wafer, and rapidly heating the surface of the wafer to a temperature at least 30° C. ...


6
Harald Okorn Schmidt, Franz Kumning, Rainer Obweger, Thomas Wirnsberger: Method and apparatus for surface treatment using inorganic acid and ozone. Lam Research, May 16, 2017: US09653328

An apparatus for treating a surface of an article includes a chamber for receiving an article to be treated. A dispenser dispenses a treatment liquid including inorganic acid onto the article. A tank stores the treatment liquid. An ozone generator communicates with a supply line entering or exiting ...


7
Douglas A Buchanan, Eduard A Cartier, Evgeni Gousev, Harald Okorn Schmidt, Katherine L Saenger: Method for etching chemically inert metal oxides. International Business Machines Corporation, Scully Scott Murphy & Presser P C, Louis J Percello Esq, February 15, 2011: US07887711

A system and method for patterning metal oxide materials in a semiconductor structure. The method comprises a first step of depositing a layer of metal oxide material over a substrate. Then, a patterned mask layer is formed over the metal oxide layer leaving one or more first regions of the metal ox ...


8
Deok kee Kim, Kenneth T Settlemyer Jr, Kangguo Cheng, Ramachandra Divakaruni, Carl J Radens, Dirk Pfeiffer, Timothy J Dalton, Katherina E Babich, Arpan P Mohorowala, Harald Okorn Schmidt: Methods and structures for protecting one area while processing another area on a chip. GLOBALFOUNDRIES, Thompson Hine, October 18, 2016: US09472402

Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided whi ...


9
Deok kee Kim, Kenneth T Settlemyer Jr, Kangguo Cheng, Ramachandra Divakaruni, Carl J Radens, Dirk Pfeiffer, Timothy Dalton, Katherina Babich, Arpan P Mahorowala, Harald Okorn Schmidt: Methods and structures for protecting one area while processing another area on a chip. International Business Machines Corporation, Whitham Curtis Christofferson & Cook PC, Joseph P Abate, June 16, 2015: US09059000

Increased protection of areas of a chip are provided by both a mask structure of increased robustness in regard to semiconductor manufacturing processes or which can be removed with increased selectivity and controllability in regard to underlying materials, or both. Mask structures are provided whi ...


10
Harald Okorn Schmidt, Dieter Frank, Franz Kumnig: Process for treating a semiconductor wafer. Lam Research, Young & Thompson, March 11, 2014: US08668777

Mixtures containing concentrated sulfuric acid used for stripping photoresist from semiconductor wafer, such as SOM and SPM mixtures, are more quickly removed from a wafer surface using another liquid also containing high concentration of sulfuric acid, with the second liquid furthermore containing ...



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