1
Haoran Duan, John W Lockwood, Sung Mo Kang: Scalable broad band input-queued ATM switch including weight driven cell scheduler. Board of Trustees of the University of Illinois, Greer Burns & Crain, July 13, 1999: US05923656 (54 worldwide citation)

An asynchronous mode transfer (ATM) switch conducting switching based upon the calculation of weights for entries corresponding to cells in an input queue to achieve a high throughput rate which avoids head of line blocking. The switch includes a cell scheduler driven by the iterative resolution of ...


2
Haoran Duan, Charles Evans, Michael Alvin Rencher, James R Emmert: On-chip test circuit and method for testing of system-on-chip (SOC) integrated circuits. Marvell International Technology, January 27, 2009: US07484188 (6 worldwide citation)

A system and method of testing IP cores contained in a system-on-chip integrated circuit is disclosed. An operation command is received on an input/output port of the circuit. The operation command includes an operation code component, data component(s), and expected time component. The received ope ...


3
Haoran Duan, Charles Evans, Michael Alvin Rencher, James R Emmert: System and method for implementing package level IP preverification for system on chip devices. Avago Technologies General IP, July 15, 2008: US07401315 (5 worldwide citation)

A method for implementing package-level intellectual property (PLIP) preverification for system on chip (SOC) devices includes providing at least one externally connected intellectual property (IP) core with an SOC. A package generic unit is provided with the IP core and is configured for providing ...


4
Haoran Duan, Charles Evans, Michael A Rencher, James R Emmert: On-chip test circuit and method for testing of system-on-chip (SOC) integrated circuits. Marvell International Technology, May 10, 2011: US07941781 (1 worldwide citation)

A system and method of testing IP cores contained in a system-on-chip integrated circuit is disclosed. An operation command is received on an input/output port of the circuit. The operation command includes an operation code component, data component(s), and expected time component. The received ope ...


5
James R Emmert, Charles Evans, Michael Alvin Rencher, Haoran Duan: Modular bonding pad structure and method. Avago Technologies General IP, January 19, 2010: US07648903

A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are p ...


6
James R Emmert, Charles Evans, Michael Alvin Rencher, Haoran Duan: Modular bonding pad structure and method. Avago Technologies General IP, September 25, 2007: US07274109

A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are p ...


7
Haoran Duan, Charles Evans, Michael Alvin Rencher, James R Emmert: System and method for implementing package level IP preverification for system on chip devices. Agilent Technologies, May 17, 2007: US20070113215-A1

A method for implementing package-level intellectual property (PLIP) preverification for system on chip (SOC) devices includes providing at least one externally connected intellectual property (IP) core with an SOC. A package generic unit is provided with the IP core and is configured for providing ...


8
James R Emmert, Charles Evans, Michael Alvin Rencher, Haoran Duan: Modular bonding pad structure and method. Avago Technologies, March 29, 2007: US20070069392-A1

A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are p ...


9
James R Emmert, Charles Evans, Michael Alvin Rencher, Haoran Duan: Modular Bonding Pad Structure And Method. Agilent Technologies, December 6, 2007: US20070278656-A1

A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are p ...


10
Haoran Duan, Charles Evans, Michael Alvin Rencher, James R Emmert: On-chip test circuit and method for testing of system-on-chip (SOC) integrated circuits. Kathy Manke, Avago Technologies, September 20, 2007: US20070220456-A1

A system and method of testing IP cores contained in a system-on-chip integrated circuit is disclosed. An operation command is received on an input/output port of the circuit. The operation command includes an operation code component, data component(s), and expected time component. The received ope ...