1
Hajime Hirata, Masatsugu Uehara, Yasuhiro Nakai, Jiro Terao: Method of manufacturing sheet, device and program for controlling sheet thickness, and sheet. Toray, Kubovcik & Kubovcik, February 15, 2005: US06856855 (14 worldwide citation)

A method of controlling the thickness of sheets manufactured by the extrusion of a material from a die having a plurality of thickness adjusting means by repeating, at specified timings, the following steps of 1) measuring the distribution of thickness of the sheets in lateral direction, 2) evaluati ...


2
Takehiko Hakui, Hajime Hirata, Hajime Kajiwara, Kiyoshi Nakajima, Yoshimitsu Akuta, Kunimichi Hatano: Vehicle height adjusting system. Honda Motor, Arent Fox, April 12, 2011: US07922181 (9 worldwide citation)

A first rotor (24; 124) and a second rotor (25; 125) are arranged in a coaxial and mutually rotatable relationship and are provided with a first driven gear (41; 141) and a second driven gear (42; 142), respectively. A drive shaft (31; 131) is also provided with a first drive gear (43; 143) and a se ...


3
Hajime Hirata: Semiconductor integrated circuit having protection circuit capable of protecting against ESD and EOS. Kawasaki Microelectronics, Oliff & Berridge, January 15, 2013: US08355228 (1 worldwide citation)

A semiconductor integrated circuit has an internal circuit having an input terminal connected to a connection terminal, a protection circuit that discharges an over-voltage supplied to the connection terminal to a power line. The protection circuit includes a first discharge circuit connected to the ...


4
Takehiko Hakui, Hajime Hirata, Hajime Kajiwara, Kiyoshi Nakajima, Yoshimitsu Akuta, Kunimichi Hatano: Vehicle height adjusting system. Honda Motor, Arent Fox Pllc, September 13, 2007: US20070210539-A1

A first rotor (24; 124) and a second rotor (25; 125) are arranged in a coaxial and mutually rotatable relationship and are provided with a first driven gear (41; 141) and a second driven gear (42; 142), respectively. A drive shaft (31; 131) is also provided with a first drive gear (43; 143) and a se ...


5
Keiko Kamata, Hajime Hirata, Yoshinari Ikegami, Kouji Nakagawa: Method for treating neoplastic cells using cycloprodigiosin or salt thereof. Knobbe Martens Olson & Bear, March 11, 2004: US20040048791-A1

Neoplastic cells are treated by examining whether a potential subject has neoplastic cells in which Rb is present and NF-B and/or AP-1 are constitutively being activated and then administering cycloprodigiosin or a pharmaceutically acceptable salt thereof in an amount effective to suppress Rb phosph ...


6
Masatsugu Uehara, Yasuhiro Nakai, Hajime Hirata: Method of manufacturing sheet. Kubovcik & Kubovcik, November 28, 2002: US20020175434-A1

A method of manufacturing a sheet by extruding and forming a polymer by using a plurality of mouthpieces each having a thickness adjusting means, comprising the steps of varying the amount of operation applied to the thickness adjusting means along a specified time series pattern, measuring a thickn ...


7
Hajime Hirata, Masatsugu Uehara, Yasuhiro Nakai, Jiro Terao: Method of manufacturing sheet, device and program for controlling sheet thickness, and sheet. Kubovcik & Kubovcik, The Farragut Building, March 13, 2003: US20030050717-A1

A method of controlling the thickness of sheets manufactured by the extrusion of a material from a die having a plurality of thickness adjusting means by repeating, at specified timings, the following steps of 1) measuring the distribution of thickness of the sheets in lateral direction, 2) evaluati ...


8
Satoru Naraba, Hajime Hirata, Takanori Tahara, Yoshiyuki Arai, Yoshio Nogami: Method and apparatus for manufacturing a liquid crystal component. Smith Patent Office, August 5, 2010: US20100197187-A1

Provided is a liquid crystal component manufacturing method wherein a gap between a panel surface of a liquid crystal module and a transparent cover is filled with a transparent resin, then, the liquid crystal module and the transparent cover are bonded by curing the resin. In the method, at the per ...


9
Hajime Hirata: Semiconductor integrated circuit having protection circuit capable of protecting against ESD and EOS. Kawasaki Microelectronics, Oliff & Berridge, October 28, 2010: US20100271739-A1

A semiconductor integrated circuit has an internal circuit having an input terminal connected to a connection terminal, a protection circuit that discharges an over-voltage supplied to the connection terminal to a power line. The protection circuit includes a first discharge circuit connected to the ...


10
Takayoshi Akamatsu, Katsumi Terada, Hajime Hirata: Mounting apparatus and mounting method. January 19, 2012: US20120015458-A1

Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns o ...