1
Yen Yi Wu, Wei Yueh Sung, Pao Huei Chang Chien, Chi Chih Chu, Cheng Yin Lee, Gwo Liang Weng: Method of making a semiconductor package and method of making a semiconductor device. Advanced Semiconductor Engineering, Cooley Godward Kronish, January 5, 2010: US07642133 (104 worldwide citation)

The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electri ...


2
Gwo Liang Weng, Shih Chang Lee, Cheng Yin Lee: Chip package structure and manufacturing method thereof. Advanced Semiconductor Engineering, Jianq Chyun IP Office, June 13, 2006: US07061079 (97 worldwide citation)

The present invention provides a chip package structure and the manufacturing method thereof, which affords higher heat dissipation efficiency and is suitable to fabricate the stack type package structure with a higher integration. The chip package structure comprises a carrier, at least a chip, a h ...


3
Gwo Liang Weng, Yung Li Lu, Cheng Yin Lee: Stackable semiconductor package. Advanced Semiconductor Engineering, Volentine & Whitt P L L C, September 15, 2009: US07589408 (30 worldwide citation)

A stackable semiconductor package includes first and second substrates, a semiconductor device, first wires, a supporting element, and a first molding compound. The semiconductor device is disposed on the first substrate. The second substrate is disposed above the semiconductor device, and the area ...


4
Gwo Liang Weng, Yung Li Lu: Stackable semiconductor package. Advanced Semiconductor Engineering, Volentine & Whitt P L L C, June 23, 2009: US07550832 (28 worldwide citation)

A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is exposed. The top package is inverted, and is adhered to the chip of the bottom package with the adhesive ...


5
Yung Li Lu, Gwo Liang Weng: Stackable semiconductor package. Advanced Semiconductor Engineering, Winston Hsu, April 29, 2008: US07365427 (19 worldwide citation)

The present invention relates to a stackable semiconductor package, comprising a first substrate, a chip, a second substrate, a plurality of second wires, a plurality of supporting elements and a molding compound. The chip is disposed on and electrically connected to the first substrate. The second ...


6
Gwo Liang Weng, Yung Li Lu, Ying Tsai Yeh: Sensor chip packaging structure. Advanced Semiconductor Engineering, Winston Hsu, March 6, 2007: US07187067 (17 worldwide citation)

A sensor chip for defining an exposed molding region is disclosed. The sensor chip includes a semiconductor chip and a metal dam bar protruding from the active surface of the semiconductor chip. The active surface of the semiconductor chip includes a sensing region and at least one bonding pad is di ...


7
Shih Chang Lee, Gwo Liang Weng, Wei Chang Tai, Cheng Yin Lee: Flip chip package. Advanced Semiconductor Engineering, Bacon & Thomas, November 9, 2004: US06815833 (15 worldwide citation)

A flip chip package mainly comprises a chip, a leadless lead frame. The leadless lead frame has a die paddle and a plurality of leads. The active surface of the chip has a plurality of bonding pads formed thereon. Besides, a plurality of bumps formed on the bonding pads are electrically connected to ...


8
Chi Chih Chu, Cheng Yin Lee, Gwo Liang Weng, Shih Chang Lee: Stacked package module. Advanced Semiconductor Engineering, Bacon & Thomas PLLC, March 6, 2007: US07187070 (13 worldwide citation)

A Stackable package module comprises a plurality of semiconductor devices in stack. One of the semiconductor devices includes a chip with an active surface and a corresponding back surface, a plurality of solder bumps and a plurality of stud bumps. The solder bumps are formed on the active surface. ...


9
Shih Chang Lee, Gwo Liang Weng: Molding apparatus for flexible substrate based package. Advanced Semiconductor Engineering, July 10, 2001: US06257857 (6 worldwide citation)

A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. Th ...


10
Gwo Liang Weng, Ching Hui Chang, Yung Li Lu, Yu Wen Chen: Semiconductor package structure. Advanced Semiconductor Engineering, Thomas Kayden Horstemeyer & Risley, October 17, 2006: US07122893 (6 worldwide citation)

A semiconductor package structure includes a semiconductor component, a substrate, solder bumps, underfill, a buffer means, and solder balls. The substrate is under the semiconductor component. A joint area is formed between the first surface of the semiconductor and the upper surface of the substra ...