1
Jean Pierre Joly, Laurent Ulmer, Guy Parat: Integrated circuit on high performance chip. Commissariat a l Energie Atomique, Brinks Hofer Gilson & Lione, November 1, 2011: US08048766 (30 worldwide citation)

A method of fabricating a die containing an integrated circuit, including active components and passive components, includes producing a first substrate containing at least one active component of active components and a second substrate containing critical components of the passive components, such ...


2
Cecile Bory, Jean Louis O Buffet, Guy Parat: Process for the production of an electric contact on a HgCdTe substrate with a P conductivity and application to the production of an N/P diode. Commissariat a l Energie Atomique, Pearne Gordon McCoy & Granger, August 23, 1988: US04766084 (14 worldwide citation)

The invention relates to a process for producing an electric contact on a HgCdTe substrate having a P conductivity and application to the production of an N/P diode. For producing an N/P diode, an insulating layer deposited on the HgCdTe substrate is etched by ion bombardment through a first mask, s ...


3
Patrice Caillat, Guy Parat, Gerard Nicolas: Process and device for checking the conformity of hybridization balls. Commissariat a l Energie Atomique, Pearne Gordon McCoy & Granger, September 12, 1995: US05450206 (9 worldwide citation)

A process for checking the conformity of hybridization balls present on a chip or a substrate and its implementation device are provided. The process includes positioning the hybridization balls of the electronic component or substrate near a strip transparent to a predetermined wavelength. The hybr ...


4
Guy Parat, Patrice Caillat, Christiane Puget: Connecting assembly of optical fibers with optical or optoelectronic components. Commissariat a l&apos Energie Atomique, Pearne & Gordon, August 20, 2002: US06435733 (6 worldwide citation)

Assembly allowing for connection of optical fibres with optical or optoelectronic components and process for manufacturing this assembly.


5
Guillaume Bouche, Guy Parat: Support for acoustic resonator and corresponding integrated circuit. STMicroelectronics, Commissariat a l Energie Atomique, Gardere Wynne Sewell, June 15, 2010: US07737804 (2 worldwide citation)

An integrated circuit includes at least one interconnection level and an acoustic resonator provided with an active element and a support. The includes at least one bilayer assembly having a layer of high acoustic impedance material and a layer of low acoustic impedance material. The support further ...


6
Adrien Gasse, Guy Parat: Array of independently-addressable resistors, and method for production thereof. Commissariat a L′Energie Atomique, Brinks Hofer Gilson & Lione, January 5, 2010: US07642893

The arrays of independently-addressable resistors are commonly used to control miniature elements. The invention proposes solving the problem caused by the loss of power dissipated in the addressed resistor by choosing, for this resistor, a material with a negative thermal coefficient resistance, wh ...


7
Claude Massit, Gerard Nicolas, Guy Parat: Heating device for embodying connections by a meltable material. Commissariat a l Energie Atomique, Hayes Soloway Hennessey Grossman & Hage P C, June 10, 1997: US05636683

A heating device is provided for connecting by means of a melting material to a connection support at least one component mounted on the support in at least one connection region at the periphery of the support. The device locally heats the support and/or the component in the connection region. Part ...


8
Patrice Caillat, Guy Parat, Gerard Nicolas: Method and device for conformance testing of hybridization balls.. Commissariat Energie Atomique, December 9, 1994: FR2706032-A1

The invention relates to a method for checking the conformity of hybridisation balls (9) presented on a chip or a substrate (1) and to the device for implementing it. The method consists of the following steps: a) positioning (210) the chip or substrate hybridisation balls against a plate which is t ...


9
Claude Massit, Gerard Nicolas, Guy Parat: Heating device to realize connections by means of a fusible material.. Commissariat Energie Atomique, August 18, 1995: FR2716302-A1

The appts. comprises a support plate (102) shaped to hold a supporting material (112) to which a component (118) or another material is to be bonded by means of thermally fusible adhesive (120). The support plate (102) has at least one raised section (106) in thermal contact with the material (112) ...


10
Guillaume Bouche, Guy Parat: Support for acoustic resonator and corresponding integrated circuit. STMicroelectronics, Commissariat a L Energie Atomique, Jenkens & Gilchrist PC, July 5, 2007: US20070152777-A1

An integrated circuit includes at least one interconnection level and an acoustic resonator provided with an active element and a support. The includes at least one bilayer assembly having a layer of high acoustic impedance material and a layer of low acoustic impedance material. The support further ...