1
Belgacem Haba Belgacem (Bel) Haba
Giles Humpston, Guilian Gao, Belgacem Haba: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 18, 2010: US07719121 (33 worldwide citation)

A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive post ...


2
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz Mentlik, July 6, 2010: US07749886 (8 worldwide citation)

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...


3
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 14, 2012: US08115308 (1 worldwide citation)

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


4
Belgacem Haba Belgacem (Bel) Haba
Kenneth Allen Honer, Belgacem Haba, David Ovrutsky, Charles Rosenstein, Guilian Gao: Method of forming a wafer level package. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 8, 2011: US08053281 (1 worldwide citation)

A method is provided for forming a microelectronic package at a wafer level. Such method can include providing a semiconductor wafer having a surface with a pattern of electrical contacts thereon. An interposer component can be provided which has a compliant dielectric layer bonded to a conductive l ...


5
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 24, 2014: US08759973

A microelectronic assembly is disclosed that includes a semiconductor wafer with contacts, compliant bumps of dielectric material overlying the first surface of the semiconductor wafer, and a dielectric layer overlying the first surface of the semiconductor wafer and edges of the compliant bumps. Th ...


6
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Belgacem Haba, Guilian Gao: Wafer level chip package and a method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, February 19, 2013: US08378487

Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.


7
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Belgacem Haba, Guilian Gao: Wafer level chip package and a method of fabricating thereof. Tessera, Lerner David Littenberg Krumholz & Mentlik, March 13, 2012: US08133808

Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.


8
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, Guilian Gao, Belgacem Haba, David Ovrutsky: Microelectronic assemblies having compliancy and methods therefor. Tessera Technologies Hungary Kft, Tessera, LERNER DAVID et al, June 26, 2008: US20080150121-A1

A method of making a microelectronic assembly includes providing a semiconductor wafer having contacts accessible at a first surface, forming compliant bumps over the first surface and depositing a sacrificial layer over the compliant bumps. The method includes grinding the sacrificial layer and the ...


9
Belgacem Haba Belgacem (Bel) Haba
Teck Gyu Kang, Belgacem Haba, Guilian Gao: Wafer level chip package and a method of fabricating thereof. Tessera, Tessera, LERNER DAVID et al, March 20, 2008: US20080067663-A1

Wafer level chip packages including risers having sloped sidewalls and methods of fabricating such chip packages are disclosed. The inventive wafer level chip packages may advantageously be used in various microelectronic assemblies.


10
Belgacem Haba Belgacem (Bel) Haba
Giles Humpston, Guilian Gao, Belgacem Haba: Microelectronic packages and methods therefor. Tessera, Tessera, LERNER DAVID et al, April 17, 2008: US20080088033-A1

A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive post ...