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Gaddam N Babu, Greggory S Bennett, Kejian Chen, Steven M Heilmann, Howell K Smith II, Louis E Winslow: Acrylamido functional disubstituted acetyl aryl ketone photoinitiators. Minnesota Mining and Manufacturing Company, Gary L Griswold, Walter N Kirn, Lorraine R Sherman, April 9, 1996: US05506279 (137 worldwide citation)

The invention provides novel acrylamide functional disubstituted acetyl aryl ketones and a process for their preparation in high yields uncontaminated by difunctional material. The invention further provides photocrosslinkable compositions comprising one or more ethylenically-unsaturated monomers an ...


2
Greggory S Bennett, Gaddam N Babu, Kejian Chen, Louis E Winslow, George F Vesley, Patrick G Zimmerman: Acrylic syrup curable to a crosslinked viscoelastomeric material. Minnesota Mining and Manufacturing Company, Harold C Knecht III, May 11, 1999: US05902836 (83 worldwide citation)

Solute polymers in solvent monomers form a coatable syrup that can be cured to a viscoelastomeric material when radiation-sensitive .alpha.-cleaving groups in either the polymer or one of the monomers are exposed to ultraviolet radiation. The solute polymers can be formed from the solvent monomers i ...


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Louis E Winslow, Greggory S Bennett, Gaddam N Babu, Paul Hattam, Michael L Tumey, Bhaskar V Velamakanni: Process for the production of an article coated with a crosslinked pressure sensitive adhesive. Minnesota Mining and Manufacturing Company, Gary L Griswold, Walter N Kirn, Harold C Knecht III, April 21, 1998: US05741543 (33 worldwide citation)

This invention relates to a process in which a composition is coated onto a substrate and crosslinked so as to form a PSA by means of polymerizing free radically polymerizable monomers from covalently attached pendent unsaturation in the polymer component of the composition. The coating can carried ...


5
Christopher A Haak, Michael A Kropp, Greggory S Bennett: Adhesives containing electrically conductive agents. 3M Innovative Properties Company, Doreen S L Gwin, October 3, 2000: US06126865 (32 worldwide citation)

Pressure sensitive adhesives and heat activatable adhesives that are the reaction product of an acrylic acid ester of a monohydric alcohol whose homopolymer has a T.sub.g less than 0.degree. C.; a non-polar ethylenically unsaturated monomer whose homopolymer has a solubility parameter of no greater ...


6
Greggory S Bennett, Louis E Winslow, Gaddam N Babu: Acrylic syrup curable to a crosslinked viscoelastomeric material. Minnesota Mining and Manufacturing Company, Gary L Griswold, Walter N Kirn, Harold C Knecht III, June 30, 1998: US05773485 (30 worldwide citation)

Solute polymers in solvent monomers form a coatable syrup that can be cured to a viscoelastomeric material when radiation-sensitive hydrogen abstracting groups in either the polymer or one of the monomers are exposed to ultraviolet radiation. The solute polymers can be formed from the solvent monome ...


7
Ashish K Khandpur, Greggory S Bennett, Allen R Siedle: Pressure-sensitive adhesive blends comprising ethylene/propylene-derived polymers and propylene-derived polymers and articles therefrom. 3M Innovative Properties Company, Scott R Pribnow, December 3, 2002: US06489400 (14 worldwide citation)

The present invention relates to a blend of at least one amorphous ethylene/propylene-derived copolymer, at least one non-stereoregular propylene-derived polymer having a melt viscosity of greater than about 500 Poise, and an optional tackifier that provide pressure-sensitive adhesive compositions i ...


8
Richard E Bennett, Louis E Winslow, Greggory S Bennett, Karunasena A Alahapperuma, Cheryl L Moore: Semiconductor wafer processing tapes. 3M Innovative Properties Company, May 22, 2001: US06235387 (13 worldwide citation)

A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturat ...


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Richard E Bennett, Louis E Winslow, Greggory S Bennett, Karunasena A Alahapperuma, Cheryl L Moore: Semiconductor wafer processing tapes. 3M Innovative Properties Company, November 12, 2002: US06478918 (12 worldwide citation)

A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturat ...


10
Greggory S Bennett, Yolanda Griebenow, Guido Hitschmann, Kurt C Melancon, Wolfgang G Schoeppel: Method of manufacturing an optical recording medium. 3M Innovative Properties Company, January 2, 2001: US06168682 (12 worldwide citation)

The invention refers to a method of manufacturing an optical recording medium comprising a first member having a first substrate, a first information storing layer, a first exposed surface and a first inner surface, a second member having a second substrate, a second exposed surface, a second inner ...