1
Charles Balian, Steven E Bergerson, Gregg C Currier: Thermal interface material with low melting alloy. Saint Gobain Performance Plastics Corporation December 12, 2006: US07147367 (20 worldwide citation)

A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic compo ...


2
Charles Balian, Steven E Bergerson, Gregg C Currier: Thermal interface material with low melting alloy. December 11, 2003: US20030227959-A1

A thermal interface composition undergoes a viscoelastic change at microprocessor operating temperatures to transfer heat generated by a heat source, such as a microprocessor to a heat sink. The composition includes a low melting alloy dispersed in a matrix. The matrix comprises a viscoelastic compo ...



Click the thumbnails below to visualize the patent trend.