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Go Tiong C: High-density electronic modules, process and product.. Irvine Sensors, September 12, 1990: EP0385979-A1

A high-density electronic module (24) is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips (22), each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so ...


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Go Tiong C: High density electronic package comprising stacked sub-modules. Irvine Sensors Corporation, PLANTE Thomas J, July 14, 1988: WO/1988/005251

A high density electronic package (16) in which a stack of layer-like sub-modules have their edges (34) secured to a stack-carrying substrate (18), the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has a cavity (72), inside which one or more IC ...


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Go Tiong C: Bonding of aligned conductive bumps on adjacent surfaces. Irvine Sensors Corporation, PLANTE Thomas J, March 23, 1989: WO/1989/002653

A bump bonding process and product are disclosed in which both pressure and heating are used in situations where the temperature should not exceed a predetermined amount, e.g., bonding of a photoconductor array to a module containing electronic processing devices. The bonding process involves eutect ...


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Go Tiong C: High-density electronic modules, process and product. Irvine Sensors Corporation, PLANTE Thomas J, May 5, 1989: WO/1989/004113

A high-density electronic module (24) is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips (22), each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so ...