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Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, Giles Humpston, Jae M Park: Microelectronic package comprising offset conductive posts on compliant layer. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 26, 2012: US08207604 (50 worldwide citation)

A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from t ...


2
Belgacem Haba Belgacem (Bel) Haba
Bruce M McWilliams, Giles Humpston, Belgacem Haba, David B Tuckerman: Structure and method of making sealed capped chips. Tessera, Lerner David Littenberg Krumholz & Mentlik, November 20, 2007: US07298030 (46 worldwide citation)

A method of making a plurality of sealed assemblies is provided which includes a) assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a top surface of the first element faces upwardly away from ...


3
Belgacem Haba Belgacem (Bel) Haba
Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba, Giles Humpston: Wafer-level fabrication of lidded chips with electrodeposited dielectric coating. Tessera Technologies Ireland, Lerner David Littenberg Krumholz & Mentlik, May 3, 2011: US07935568 (39 worldwide citation)

A method is provided for fabricating a unit including a semiconductor element such as a sensor unit, e.g., for optical imaging. A semiconductor element has plurality of conductive features exposed at the front surface and semiconductive or conductive material exposed at least one of the front and re ...


4
Belgacem Haba Belgacem (Bel) Haba
Giles Humpston, Guilian Gao, Belgacem Haba: Microelectronic packages and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 18, 2010: US07719121 (33 worldwide citation)

A microelectronic package includes a microelectronic element having contacts, a flexible substrate spaced from and overlying the microelectronic element and a plurality of conductive posts extending from the flexible substrate and projecting away from the microelectronic element. The conductive post ...


5
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston, Moti Margalit: Semiconductor packaging process using through silicon vias. DigitalOptics Corporation Europe, Lerner David Littenberg Krumholz & Mentlik, June 5, 2012: US08193615 (30 worldwide citation)

A microelectronic unit 400 can include a semiconductor element 401 having a front surface, a microelectronic semiconductor device adjacent to the front surface, contacts 403 at the front surface and a rear surface remote from the front surface. The semiconductor element 401 can have through holes 41 ...


6
Belgacem Haba Belgacem (Bel) Haba
Robert Burtzlaff, Belgacem Haba, Giles Humpston, David B Tuckerman, Michael Warner, Craig S Mitchell: Back-face and edge interconnects for lidded package. Tessera, Lerner David Littenberg Krumholz & Mentlik, May 29, 2007: US07224056 (23 worldwide citation)

A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and ...


7
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston: Microelectronic packages fabricated at the wafer level and methods therefor. Tessera, Lerner David Littenberg Krumholz & Mentlik, July 20, 2010: US07759166 (20 worldwide citation)

A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are ...


8
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Giles Humpston, David Ovrutsky, Laura Mirkarimi: Reconstituted wafer stack packaging with after-applied pad extensions. Tessera, Lerner David Littenberg Krumholz & Mentlik, June 11, 2013: US08461672 (14 worldwide citation)

A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Trac ...


9
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Masud Beroz, David B Tuckerman, Giles Humpston, Richard Dewitt Crisp: Methods for forming connection structures for microelectronic devices. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 14, 2010: US07793414 (12 worldwide citation)

Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a bas ...


10
Belgacem Haba Belgacem (Bel) Haba
Michael J Nystrom, David B Tuckerman, Belgacem Haba, Giles Humpston, Jesse Burl Thompson: Pin referenced image sensor to reduce tilt in a camera module. Tessera, Lerner David Littenberg Krumholz & Mentlik, September 22, 2009: US07593636 (12 worldwide citation)

The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit inc ...