51
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stumpfl, Josef Thumbs, Stefan Wein, Holger Worner: Electronic component and process for producing the electronic component. Lerner And Greenberg Pa, Patent Attorneys And Attorneys At Law, March 6, 2003: US20030042590-A1

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to ...


52
Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Worner, Robert Christian Hagen, Christian Stumpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips, and fabrication method. Lerner And Greenberg Pa, Patent Attorneys And Attorneys At Law, March 6, 2003: US20030042591-A1

An electronic component is formed with at least two semiconductor chips disposed on a carrier substrate. Active chip surfaces of the semiconductor chips comprise central contact surfaces, respectively, on which opposing solder contact surfaces are formed. These are conductively connected to an inter ...


53
Michael Bauer, Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Holger Woerner: Biosensor with smart card configuration. Edell Shapiro & Finnan, February 9, 2006: US20060027905-A1

A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the ...


54
Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim, Khoon Lam Chua: Integrated Circuit Package and a Method for Forming an Integrated Circuit Package. Slater & Matsil, May 29, 2008: US20080122053-A1

A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a resu ...


55
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stumpfl, Josef Thumbs, Stefan Wein, Holger Worner: Electronic component with at least two stacked semiconductor chips and process for producing the electronic component. Lerner And Greenberg Pa, March 6, 2003: US20030043555-A1

An electronic component has a carrier substrate to accommodate two semiconductor chips that are connected to each other. The second semiconductor chip rests with two opposite marginal supporting regions on an upper side of the carrier substrate. The first semiconductor chip is disposed at a distance ...


56
Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Worner, Robert Christian Hagen, Christian Stumpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component. Lerner And Greenberg Pa, March 13, 2003: US20030047813-A1

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate ...


57
Michael Bauer, Christian Birzer, Gerald Ofner, Stephan Stoeckl: Electronic component with cavity fillers made from thermoplast and method for production thereof. Dicke Billig & Czaja Pllc, April 27, 2006: US20060088954-A1

An electronic component and a method for fabricating it is disclosed, where the component comprises a semiconductor chips which has flip-chip contacts. These contacts are fixed on a rewiring substrate, the interspace between the rewiring substrate and the semiconductor chip being filled with a therm ...


58
Robert Christian Hagen, Gerald Ofner: Method for producing an electronic component with shielding. Infineon Technologies, Lerner Greenberg Stemer, August 17, 2006: US20060183306-A1

An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within ...


59
Thorsten Meyer, Rainer Leuschner, Gerald Ofner, Reinhard Hess, Recai Sezi: Electronic Device and Manufacturing Method. October 6, 2011: US20110241218-A1

A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in m ...


60
Kai Chong Chan, Charles Wee Ming Lee, Gerald Ofner: Semiconductor Package and Method for Producing the Same. Infineon Technologies, Edell Shapiro & Finnan, December 16, 2010: US20100314721-A1

A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each ...



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