1
Anton Gerald Ofner: Magnifying spectacles with variable focus, variable magnification factor and automatic parallax compensation. Olympus Austria Gesellschaft, Walter C Farley, October 26, 1999: US05971540 (56 worldwide citation)

Magnifying spectacles for surgical use have an automatic focusing device, a device for automatically altering the magnification factor and a device for automatic parallax compensation corresponding to the current focal length. During surgical operations, alteration of the working distance is commonl ...


2
Bernd Goller, Gerald Ofner, Josef Thumbs, Holger Wörner, Robert Christian Hagen, Christian Stümpfl, Stefan Wein: Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, March 23, 2004: US06710455 (28 worldwide citation)

An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate ...


3
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Josef Thumbs, Stefan Wein, Holger Woerner: Electronic component with a plastic package and method for production. Infineon Technologies, Edell Shapiro & Finnan, October 2, 2007: US07276783 (24 worldwide citation)

An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of th ...


4
Michael Bauer, Peter Strobel, Gerald Ofner, Edward Fürgut, Simon Jerebic, Thomas Bemmerl, Markus Fink, Hermann Vilsmeier: Electronic component and semiconductor wafer, and method for producing the same. Infineon Technologies, Dicke Billig Czaja PLLC, September 2, 2008: US07420262 (20 worldwide citation)

The invention relates to an electronic component and a semiconductor wafer, and a method for producing them. The semiconductor wafer has strip-type separating regions. The separating regions are provided with through contacts in the direction of the rear side of the semiconductor wafer. The semicond ...


5
Thorsten Meyer, Rainer Leuschner, Gerald Ofner, Reinhard Hess, Recai Sezi: Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads. Infineon Technologies, Slater & Matsil L, May 22, 2012: US08183696 (19 worldwide citation)

A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in m ...


6
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Universal package for an electronic component with a semiconductor chip and method for producing the universal package. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Gregory L Mayback, March 15, 2005: US06867471 (14 worldwide citation)

An electronic component has a semiconductor chip with chip contacts. The chip contacts are mechanically fixed on a wiring structure and electrically connected to the wiring structure. The wiring structure is formed as a region of a structured metal plate or as a region of a structured metal layer of ...


7
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stümpfl, Josef Thumbs, Stefan Wein, Holger Wörner: Electronic component and process for producing the electronic component. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, January 27, 2004: US06683374 (11 worldwide citation)

An electronic component has at least a first semiconductor chip module, a second semiconductor chip module, and a substrate to accommodate the semiconductor chip modules. In this case, active chip surfaces of the two semiconductor chip modules each have a central contact area, which are disposed to ...


8
Bernd Goller, Robert Christian Hagen, Gerald Ofner, Christian Stuempfl, Stefan Wein, Holger Wörner: Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, April 14, 2009: US07517722 (9 worldwide citation)

An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper ...


9
Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim: Magnetically alignable integrated circuit device. Infineon Technologies, Dicke Billig & Czaja PLLC, August 9, 2011: US07994608 (7 worldwide citation)

An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.


10
Robert Christian Hagen, Gerald Ofner: Electronic component with shielding and method for its production. Infineon Technologies, Laurence A Greenberg, Werner H Stemer, Ralph E Locher, May 16, 2006: US07045881 (6 worldwide citation)

An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within ...



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