1
Brian S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, December 6, 1994: US05371654 (318 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


2
Brian S Beaman, Keith E Fogel, Paul A Lauro, Maurice H Norcott, Da Yuan Shih, George F Walker: Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer. International Business Machines Corporation, Daniel P Morris, June 3, 1997: US05635846 (218 worldwide citation)

A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard pack ...


3
Brain S Beaman, Fuad E Doany, Keith E Fogel, James L Hedrick Jr, Paul A Lauro, Maurice H Norcott, John J Ritsko, Leathen Shi, Da Yuan Shih, George F Walker: Method of forming a three dimensional high performance interconnection package. International Business Machines Corporation, Daniel P Morris, July 2, 1996: US05531022 (212 worldwide citation)

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is fo ...


4
Brian S Beaman, Keith E Fogel, Jungihl Kim, Wolfgang Mayr, Jane M Shaw, George F Walker: Connector assembly for chip testing. International Business Machines, Perman & Green, December 4, 1990: US04975079 (163 worldwide citation)

An electrical connector is described for making contact with a plurality of convex and deformable contacts on an electronic device. The electrical connector comprises a substrate having a plurality of conductors which extend above its surface. A polymeric material is disposed on the surface of the s ...


5
George F Walker, Arthur Zingher: Spring array connector. International Business Machines Corporation, Perman & Green, April 5, 1994: US05299939 (123 worldwide citation)

A spring array connector includes a unitary resilient layer of multiple springs having a layer of multiple electrically conducting lines, electrical contacts and electrical terminals. Each spring of the array is independently bendable and each of the conducting lines is electrically isolated from th ...


6
Paul W Cotues, Paul A Moskowitz, Philip Murphy, Mark B Ritter, George F Walker: Stepped electronic device package. International Business Machines Corporation, Daniel P Morris, August 24, 1993: US05239447 (115 worldwide citation)

An electronic device packaging structure is described wherein an electronic device is electrically connected to a substrate wherein the electronic device subtends a non-normal angle with respect to the substrate. In a more specific embodiment, a plurality of electronic devices are stacked at offset ...


7
Perminder S Bindra, Jerome J Cuomo, Thomas P Gall, Anthony P Ingraham, Sung K Kang, Jungihl Kim, Paul Lauro, David N Light, Voya R Markovich, Ekkehard F Miersch, Jaynal A Molla, Douglas O Powell, John J Ritsko, George J Saxenmeyer Jr, Jack A Varcoe, George F Walker: Method of fabricating nendritic materials. International Business Machines Corporation, Daniel P Morris, Alvin J Riddles, February 9, 1993: US05185073 (82 worldwide citation)

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating wi ...


8
Eleftherios Adamopoulos, Jungihl Kim, Kang Wook Lee, Tae S Oh, Terrence R O Toole, Sampath Purushothaman, John J Ritsko, Jane M Shaw, Alfred Viehbeck, George F Walker: Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier. International Business Machines Corporation, Scully Scott Murphy & Presser, December 10, 1996: US05582858 (79 worldwide citation)

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality ...


9
Marie Angelopoulos, Wu Song Huang, Richard D Kaplan, Marie Annick Le Corre, Stanley E Perreault, Jane M Shaw, Michel R Tissier, George F Walker: Electrically conductive polymeric. International Business Machines Corporation, Daniel P Morris, March 30, 1993: US05198153 (78 worldwide citation)

Structures containing conducting polymers and methods of fabrication thereof. Electrical conductivity can be induced in polymers selected from the group of substituted and unsubstituted polyanilines, polyparaphenylenvinyles, substituted and unsubstituted polythiophenes substituted and unsubstituted ...


10
James M Leas, Robert W Koss, George F Walker, Charles H Perry, Jody J Van Horn: Semiconductor wafer test and burn-in. International Business Machines Corporation, Richard Kotulak, February 4, 1997: US05600257 (77 worldwide citation)

An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chi ...