1
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Sockets for electronic components and methods of connecting to electronic components. Form Factor, David J Larwood, Gerald E Linden, June 30, 1998: US05772451 (372 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom s ...


2
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of planarizing tips of probe elements of a probe card assembly. FormFactor, David J Larwood, Gerald E Linden, November 2, 1999: US05974662 (326 worldwide citation)

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the spa ...


3
Gary W Grube, Marc C Naddell, Mark L Shaughnessy: Method for providing communication services based on geographic location. Motorola, Daniel C Crilly, Timothy W Markison, July 7, 1998: US05778304 (315 worldwide citation)

Communication services can be controlled within geographic areas (126) by a communication resource controller (101). This occurs, when the communication resource controller (101) receives the location of a particular communication unit (102, 103) and a particular service request. Having this informa ...


4
Gary W Grube, Marc C Naddell, Mark L Shaughnessy: Method and apparatus for monitoring environmental conditions in a communication system. Motorola, Susan L Lukasik, February 29, 2000: US06031455 (312 worldwide citation)

A method and apparatus for monitoring and processing environmental conditions within a wireless communication system is accomplished when a subscriber (22), or group of subscribers, sense an environmental condition or conditions. Upon sensing the particular environmental condition (28) or conditions ...


5
Gary W Grube, Leslie Gabor Seymour: Group location and route sharing system for communication units in a trunked communication system. Motorola, Steven R Santema, Terri S Hughes, Indira Saladi, April 26, 2005: US06885874 (296 worldwide citation)

Methods are disclosed for sharing location and route information between communication units (e.g., talkgroup members) that are subscribed to a group location sharing service. The group location sharing service is event-based, such that the communication units may form a subset of a talkgroup desiri ...


6
Gaetan L Mathieu, Benjamin N Eldridge, Gary W Grube: Lithographic contact elements. FormFactor, Blakely Sokoloff Taylor & Zafman, July 3, 2001: US06255126 (227 worldwide citation)

A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structu ...


7
Mark L Shaughnessy, Michael D Kotzin, Lester F Eastwood Jr, Gary W Grube: Method of dynamically establishing communication of incoming messages to one or more user devices presently available to an intended recipient. Motorola, Susan L Lukasik, July 27, 1999: US05928325 (225 worldwide citation)

A method of dynamically establishing real-time communication of incoming messages to one or more user devices presently available to an intended recipient. This is accomplished by intelligently coupling a central agent to a plurality of communication networks. The central agent, in response to a det ...


8
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of fabricating an interconnection element. David Larwood, January 8, 2002: US06336269 (216 worldwide citation)

Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, genera ...


9
Gary W Grube: Microelectronic spring with additional protruding member. Formfactor, Ken Burraston, O&apos Melveny & Myers, November 2, 2004: US06811406 (200 worldwide citation)

Various structural features for modifying the performance characteristic of cantilevered microelectronic spring structures are disclosed. Generally, the features comprise a protruding member mounted between a supporting substrate and the transverse cantilever beam of a microelectronic spring structu ...


10
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of mounting resilient contact structures to semiconductor devices. FormFactor, David Larwood, Gerald Linden, November 3, 1998: US05829128 (199 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...