11
Sean Lie, Vikrama Ditya, Gary R Lauterbach: Distributed packet switching in a source routed cluster server. Advanced Micro Devices, May 3, 2016: US09331958 (4 worldwide citation)

A cluster compute server includes nodes coupled in a network topology via a fabric that source routes packets based on location identifiers assigned to the nodes, the location identifiers representing the locations in the network topology. Host interfaces at the nodes may be associated with link lay ...


12
Robert J Drost, Gary R Lauterbach, Danny Cohen: Active socket for facilitating proximity communication. Sun Microsystems, Park Vaughan & Fleming, August 11, 2009: US07573720 (3 worldwide citation)

One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additio ...


13
Gary R Lauterbach, Robert J Drost: Computer system architecture using a proximity I/O switch. Sun Microsystems, Park Vaughan & Fleming, Gilbert C Wong, January 30, 2007: US07170121 (3 worldwide citation)

One embodiment of the present invention provides a proximity I/O switch, which is configured to transfer data between the components in a computer system. This proximity I/O switch is comprised of multiple switch chips, which are coupled together through capacitive coupling. This enables the multipl ...


14
Gary R Lauterbach: Replicated service architecture. Oracle America, Osha • Liang, August 24, 2010: US07783786 (2 worldwide citation)

A system comprising a first node and a second node located in a single multiprocessor system, the first node including a first router and a first replicated service executing on a first operating system, the second node including a second router and a second replicated service executing on a second ...


15
Gary R Lauterbach: Apparatus to facilitate multithreading in a computer processor pipeline. Park Vaughan & Fleming, March 6, 2003: US20030046517-A1 (1 worldwide citation)

One embodiment of the present invention provides a system to facilitate multithreading a computer processor pipeline. The system includes a pipeline that is configured to accept instructions from multiple independent threads of operation, wherein each thread of operation is unrelated to the other th ...


16
Ronald J Ricciardi, Angelo Ferrara, Joseph L Hartmann, Gary R Lauterbach: Weigh feeding apparatus. Acrison, April 1, 1986: USRE032101

Disclosed herein is an automatically controlled weigh feeding apparatus including a container for prefilling with a substance, a device for discharging the substance from the container at a controllable rate, apparatus for weighing the substance being discharged and for producing an electrical signa ...


17
Robert J Drost, Gary R Lauterbach, Danny Cohen: Method for manufacturing an active socket for facilitating proximity communication. Oracle America, Park Vaughan Fleming & Dowler, Anthony Jones, May 1, 2012: US08166644

One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additio ...


18
Arthur T Leung, Gary R Lauterbach: Execution unit and method for using architectural and working register files to reduce operand bypasses. Sun Microsystems, William S Pennie & Edmonds Galliani, October 12, 1999: US05964862

A CPU (central processing unit) of a computer. The CPU comprises a dispatch controller, a pipeline, a working register file, and an architectural register file. The dispatch controller dispatches instructions for execution and determines whether the dispatched instructions are valid or invalid. The ...


19
Ivan E Sutherland, Robert J Drost, Gary R Lauterbach, Howard L Davidson: Integrated circuit assembly module that supports capacitive communication between semiconductor dies. Park Vaughan & Fleming, July 29, 2004: US20040145063-A1

One embodiment of the present invention provides an integrated circuit assembly module, including a first semiconductor die and a second semiconductor die, each semiconductor die with an active face upon which active circuitry and signal pads reside and a back face opposite the active face. The firs ...


20
Robert J Drost, Gary R Lauterbach, Danny Cohen: Active socket for facilitating proximity communication. Sun Microsystems, Pvf Sun Microsystems, C O Park Vaughan & Fleming, October 29, 2009: US20090269884-A1

One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additio ...