1
Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio: Method of making thermally enhanced substrate-base package. Unisem, Wiggin and Dana, June 22, 2010: US07741158 (55 worldwide citation)

An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a ...


2
Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio: Method of making thermally enhanced substrate-base package. Advanced Interconnect Technologies a Corporation of Mauritius, Wiggin And Dana, December 13, 2007: US20070284733-A1

An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a ...