1
Hiroshi Yanase, Fukuo Kanno, Takeshi Abe: Encapsulation of electronic device. Asahi Glass Company, Oblon Fisher Spivak McClelland & Maier, January 25, 1983: US04370292 (34 worldwide citation)

An encapsulation of an electronic device is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1:4 to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 ...


2
Keiichi Nakaya, Kunio Tanaka, Fukuo Kanno, Mitaka Kobayashi: Magnesium hydroxide, process for its production and resin composition containing it. Asahi Glass Company, Oblon Fisher Spivak McClelland & Maier, October 6, 1987: US04698379 (26 worldwide citation)

Magnesium hydroxide of a substantially spherical particle form having an average particle size of from 5 to 500 .mu.m and a specific surface area of from 25 to 1 m.sup.2 /g.


3
Fukuo Kanno, Keiichi Nakaya: Fire retardant polyolefin composition. Asahi Glass Company, Oblon Fisher Spivak McClelland & Maier, October 7, 1986: US04615831 (15 worldwide citation)

A fire retardant polyolefin composition comprising from 40 to 70% by weight of magnesium hydroxide and from 30 to 60% by weight of a polyolefin, wherein from 0.3 to 10% by weight, based on the magnesium hydroxide, of at least one N-hydroxyalkylamide of a higher fatty acid selected from the group rep ...


4
Shigeyuki Narisawa, Hiroshi Yanase, Fukuo Kanno: Moldable polyphenylenesulfide. Asahi Glass Company, Oblon Fisher Spivak McClelland & Maier, June 23, 1981: US04274993 (14 worldwide citation)

A moldable polyphenylenesulfide is obtained by a heat-treatment of a partially crosslinked or noncrosslinked polyphenylenesulfide at a temperature of higher than 290.degree. C. in an atmosphere being substantially absence of oxygen.


5
Yasuki Miura, Fukuo Kanno, Masataka Yokota: Resin composition. Asahi Glass Company, Oblon Spivak McClelland Maier & Neustadt P C, August 24, 2004: US06780944 (8 worldwide citation)

A resin composition which comprises from 50 to 99.5 parts by weight of a polyphenylene sulfide and from 0.5 to 50 parts by weight of a fluorinated resin having a solidification temperature of at least 237° C. when cooled at a cooling rate of 10° C./min after melting in a nitrogen atmosphere at 330° ...