1
Frank Djennas, Victor K Nomi, John R Pastore, Twila J Reeves, Les Postlethwait: Method for making semiconductor device having no die supporting surface. Motorola, Minh Hien N Clark, December 12, 1995: US05474958 (331 worldwide citation)

A wire bondable plastic encapsulated semiconductor device (58) having no die supporting surface can be manufactured. In one embodiment, a semiconductor die (22) and a plurality of conductors (12) extending toward the periphery of the die are provided. The die is rigidly held in place on a workholder ...


2
Frank Djennas, Isaac T Poku, Robert Yarosh: Semiconductor device having universal low-stress die support and method for making the same. Motorola, July 5, 1994: US05327008 (218 worldwide citation)

A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many diffe ...


3
Frank Djennas, Isaac T Poku, Robert Yarosh: Semiconductor device having x-shaped die support member and method for making the same. Motorola, Patricia S Goddard, June 13, 1995: US05424576 (197 worldwide citation)

A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many diffe ...


4
Frank Djennas, Wilhelm Sterlin, Bennett A Joiner Jr: Low profile semiconductor device with like-sized chip and mounting substrate. Motorola, March 31, 1998: US05734201 (53 worldwide citation)

A low profile semiconductor device (24) is manufactured by mounting a semiconductor die (26) onto a substrate (28) using an interposer (30). The interposer couples an active surface (32) of the die (26) to conductive traces (33) on the top surface of the substrate. The interposer is directionally co ...


5
Frank Djennas, Alan H Woosley: Semiconductor device having window-frame flag with tapered edge in opening. Motorola, Patricia S Goddard, August 3, 1993: US05233222 (32 worldwide citation)

A semiconductor device (30) utilizes a lead frame (32) having a window-frame flag (36). An opening (44) within the flag creates an interior edge (46) which is tapered, preferably to an angle .phi. that is between 55.degree. and 65.degree.. The tapered interior edge reduces boundary-layer separation ...


6
Frank Djennas, Curtis W Mitchell: Silver flashing process on semiconductor leadframes. Motorola, Harry A Wolin, November 28, 1989: US04883774 (12 worldwide citation)

A process for flashing a thin layer of silver on metal leadframes using no mask steps and a minimal amount of silver. An unmasked metal leadframe is placed into a cleaning bath that includes silver in solution and has no outside electrical driving force to assist plating. The leadframe is removed fr ...