1
Alan G Wood, Warren M Farnworth, Ford Grigg, Salman Akram: Direct die contact (DDC) semiconductor package. Micron Technology, Stephen A Gratton, November 21, 2000: US06150717 (156 worldwide citation)

A semiconductor package and method for fabricating the package are provided. The package includes a housing having individual channels, each adapted to retain a semiconductor die in electrical communication with electrical connectors. The dice can include solder bumps, formed on electrodes, using el ...


2
Alan G Wood, Warren M Farnworth, Ford Grigg, Salman Akram: Direct die contact (DDC) semiconductor package. Micron Technology, Stephen A Gratton, August 22, 2000: US06107122 (142 worldwide citation)

A semiconductor package and method for fabricating the package are provided. The package includes a housing having individual channels, each adapted to retain a semiconductor die in electrical communication with electrical connectors. The dice can include solder bumps, formed on electrodes, using el ...


3
Warren M Farnworth, Ford Grigg: Method for fabricating solder bumps by wave soldering. Micron Technology, Stephen A Gratton, April 16, 2002: US06372624 (14 worldwide citation)

A method and system for fabricating solder bumps on semiconductor components are provided. The component can be a wafer, a die, a package, or a BGA substrate. The component is provided with electrodes, such as aluminum bond pads, on which the solder bumps are formed. Initially, the electrodes are cl ...


4
Ford Grigg, Kenneth N Glover: System with polymer masking flux for fabricating external contacts on semiconductor components. Micron Technology, Stephen A Gratton, February 15, 2005: US06854633 (7 worldwide citation)

A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contact pads during a reflow bonding pro ...


5
Warren M Farnworth, Ford Grigg: System for fabricating solder bumps on semiconductor components. Micron Technology, Stephen A Gratton, October 28, 2003: US06637638 (4 worldwide citation)

A method and system for fabricating solder bumps on semiconductor components are provided. The component can be a wafer, a die, a package, or a BGA substrate. The component is provided with electrodes, such as aluminum bond pads, on which the solder bumps are formed. Initially, the electrodes are cl ...


6
Ford Grigg, Kenneth N Glover: Process for fabricating external contacts on semiconductor components. Micron Technology, Stephen A Gratton, August 9, 2005: US06926191 (1 worldwide citation)

A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contact pads during a reflow bonding pro ...


7
Ford Grigg, Kenneth N Glover: Masking flux for semiconductor components. Stephen A Gratton, The Law Office Of Steve Gratton, October 30, 2003: US20030201309-A1

A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contact pads during a reflow bonding pro ...