1
Floyd Eide: Integrated circuit chip stacking. Dense Pac Microsystems, Spensley Horn Jubas & Lubitz, September 11, 1990: US04956694 (287 worldwide citation)

A device for increasing the density of integrated circuit chips on a printed circuit board. A plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board. Each of the input/output data terminals, power and ground terminals of th ...


2
Floyd Eide: Stackable layer containing ball grid array package. Irvine Sensors, W Eric Boyd Esq, July 10, 2007: US07242082 (9 worldwide citation)

Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The l ...


3
Floyd Eide: Stackable layer containing ball grid array package. Aprolase Development Co, July 24, 2012: USRE043536

Layers suitable for stacking in three dimensional, multilayer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are underfilled and may be bonded together to form a stack of layers. The lea ...


4
Floyd Eide: Stackable layer containing ball grid array package. W Eric Boyd Esq, Irvine Sensors Corporation, March 16, 2006: US20060055039-A1

Layers suitable for stacking in three dimensional, multi-layer modules are formed by interconnecting a ball grid array electronic package to an interposer layer which routes electronic signals to an access plane. The layers are under-filled and may be bonded together to form a stack of layers. The l ...