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Pablo Benitez, Juan C Minano, Fernando Munoz: Compact folded-optics illumination lens. Light Prescriptions Innovators, Thomas F Lebens, Sinsheimer Juhnke Lebens & McIvor, February 20, 2007: US07181378 (127 worldwide citation)

The present embodiments provide for apparatuses, and methods for manufacturing apparatuses to convert a first distribution of an input radiation to a second distribution of output radiation. The apparatus can be defined in some embodiments by generating a two-dimensional representation of three acti ...


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Julio Cesar Chaves, Juan Carlos Minano, Pablo Benitez, William A Parkyn Jr, Waqidi Falicoff, Fernando Munoz, Yupin Sun: Optical device for LED-based lamp. Light Prescriptions Innovators, Sinsheimer Juhnke Lebens & Mclvor, Thomas F Lebens, February 12, 2008: US07329029 (73 worldwide citation)

An optical device for coupling the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector positioned adjacent the transfer section to receive light from the transfer section and spread t ...


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Julio Cesar Chaves, Juan Carlos Minano, Pablo Benitez, William A Parkyn Jr, Waqidi Falicoff, Fernando Munoz, Yupin Sun, Oliver Dross, Roberto Alvarez: Optical device for LED-based lamp. Light Prescriptions Innovators, Drinker Biddle & Reath, December 13, 2011: US08075147 (40 worldwide citation)

An optical device for coupling the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector positioned adjacent the transfer section to receive light from the transfer section and spread t ...


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Julio Cesar Chaves, Juan Carlos Minano, Pablo Benitez, William A Parkyn Jr, Waqidi Falicoff, Fernando Munoz, Yupin Sun: Optical device for LED-based lamp. Light Prescriptions Innovators, Thomas F Lebens, Sinsheimer Juhnke Lebens & McIvor, July 13, 2010: US07753561 (24 worldwide citation)

An optical device for coupling the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector positioned adjacent the transfer section to receive light from the transfer section and spread t ...


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Jorge Antonio Cofre Luna, Jorge Villablanca, Fernando Munoz: Cable comprising a layer able to emit light radiation. Nexans, Sofer & Haroun, February 17, 2015: US08958671 (1 worldwide citation)

A power and/or telecommunication cable (Ia,Ib) includes one or several conductor elements (10,20,30) surrounded by an outer sheath, where the outer sheath (40,50) comprising a first layer (40a, 40b) able to emit light radiation, and a second layer (50) made of a light transmitting thermoplastic poly ...


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Kaushik A Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise: On-chip cooling systems for integrated circuits. International Business Machines Corporation, Schmeiser Olsen & Watts, Steven Capella, February 9, 2010: US07659616 (1 worldwide citation)

Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not ...


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Kaushik A Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise: On-chip cooling for integrated circuits. International Business Machines Corporation, Schmeiser Olsen & Watts, Joseph Abate, July 23, 2013: US08492295

A semiconductor structure fabrication method. A provided structure includes: a semiconductor substrate, a transistor on the semiconductor substrate, N interconnect layers on the semiconductor substrate, and a temporary filling region within the N layers. N is at least 2. The temporary filling region ...


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Kaushik A Kumar, Andres Fernando Munoz, Michael Ray Sievers, Richard Stephen Wise: On-chip cooling systems for integrated circuits. International Business Machines Corporation, Schmeiser Olsen & Watts, Joseph Abate, October 30, 2012: US08298966

Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not ...