1
Herbert P Byrnes, Jean Marc Halbout, Michael R Scheuermann, Eugene Shapiro: Thin interface pellicle for dense arrays of electrical interconnects. International Business Machines Corporation, Robert M Trepp, May 4, 1993: US05207585 (168 worldwide citation)

A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion the ...


2
Se J Hong, Ravindra K Nair, Eugene Shapiro: High speed machine for the physical design of very large scale integrated circuits. International Business Machines Corporation, Jack M Arnold, November 20, 1984: US04484292 (99 worldwide citation)

Method and apparatus for the physical design of very large scale integrated (VLSI) circuits, and in particular the interconnection and wire routing between circuits formed on a chip. Apparatus is set forth for determining the wire routings in a VLSI circuit comprised of cells, wherein the cells are ...


3
Brian Mravic, Deepak Mahulikar, Gerald N Violette, Eugene Shapiro, Henry J Halverson: Lead-free bullett. Olin Corporation, Gregory S Rosenblatt, March 21, 1995: US05399187 (91 worldwide citation)

A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.


4
Se J Hong, Ravindra K Nair, Eugene Shapiro: High speed machine for the physical design of very large scale integrated circuits. International Business Machines Corporation, Jack M Arnold, June 3, 1986: US04593351 (43 worldwide citation)

Method and apparatus for the physical design of very large scale integrated (VLSI) circuits, and in particular the interconnection and wire routing between circuits formed on a chip. Apparatus is set forth for determining the wire routings in a VLSI circuit comprised of cells, wherein the cells are ...


5
Eugene Shapiro, Jagdeep S Buttar, Trung Vinh, Tahir A Ali: Apparatuses and methods for loading a head onto a disk medium. Western Digital, October 8, 2013: US08553365 (36 worldwide citation)

Systems and methods for improving loading and unloading of a read or write head onto and off of a disk medium. Particular embodiments may assist in loading a read or write head to, or unloading a read or write head from, a load location over a surface of a disk medium in such a manner that damage to ...


6
Brian Mravic, Deepak Mahulikar, Gerald Noel Violette, Eugene Shapiro, Henry J Halverson: Lead-free shot. Olin Corporation, Gregory S Wiggin & Dana Rosenblatt, September 29, 1998: US05814759 (29 worldwide citation)

A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.


7
Brent T Hailpern, Lee W Hoevel, Eugene Shapiro: Multi-microprocessor for controlling shared memory. International Business Machines Corporation, Sughrue Mion Zinn Macpeak and Seas, November 14, 1989: US04881164 (27 worldwide citation)

In a data processing system including a relatively large, page-formatted memory, memory control functions are distributed over a plurality of microprocessors connected in an array with each microprocessor controlling a respective area of the large memory. Upon overflow of its assigned memory area, a ...


8
Eugene Shapiro, Frank N Mandigo: Copper-tin alloys having improved wear properties. Olin Corporation, Barry L Kelmachter, Howard M Cohn, Paul Weinstein, May 6, 1986: US04586967 (18 worldwide citation)

A copper-tin alloy having improved wear performance and a process for forming the alloy is described herein. The alloy consists essentially of about 2% to about 11%, preferably about 3.5% to about 9% tin, about 0.03% to about 0.75%, preferably about 0.08% to about 0.5% phosphorous and the balance es ...


9
Brian Mravic, Stanley Shapiro, W Gary Watson, Eugene Shapiro: Method of processing copper base alloys. Olin Corporation, Robert A Dawson, Robert H Bachman, January 10, 1978: US04067750 (18 worldwide citation)

A process of heat treating and mechanically working copper base alloys containing chromium, zirconium and vanadium is disclosed. The combination of alloying ingredients, hot and cold rolling, annealing and aging steps increases both the strength and electrical conductivity properties of the alloy wi ...


10
Brian Mravic, Eugene Shapiro: Process and apparatus for improving cold rollability and/or strip annealability of metals and metal alloys. Olin Corporation, Barry L Kelmachter, Howard M Cohn, Paul Weinstein, September 20, 1983: US04405386 (16 worldwide citation)

Selective heating of edge and near-edge portions of a strip material is used to increase the ductility of the strip material at these portions and to improve the cold rollability and/or strip annealability of the strip material. The selective heating may be performed either by radiant heating or by ...