1
Larry R Lockwood, Kimberly R Gleason, Eric W Strid: Wafer probe. Cascade Microtech, Dellett Smith Hill & Bedell, September 29, 1987: US04697143 (193 worldwide citation)

A wafer probe is provided having metallic transmission lines mounted on a tapered alumina substrate generally surrounded by microwave absorbing material. The probe provides for on-wafer measurements of small planar devices at frequencies from DC to at least 18 GHz with low inductance, and with const ...


2
Jeremy Burr, Gregory Nordgren, Eric W Strid, Kimberly R Gleason: Coaxial wafer probe with tip shielding. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, October 15, 1996: US05565788 (140 worldwide citation)

A shielded microwave probe tip assembly includes an end of a coaxial cable coupled to probe fingers forming a coplanar controlled impedance microwave transmission line where the ground probe fingers are interconnected by a shield member that is spaced apart from the signal line probe finger but is p ...


3
K Reed Gleason, Keith E Jones, Eric W Strid: Microwave wafer probe having replaceable probe tip. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, July 18, 1989: US04849689 (128 worldwide citation)

A microwave wafer probe having a replaceable planar transmission line probe tip which detachably connects to a planar transmission line circuit board within the probe head. The circuit board may include passive and/or active electrical circuit components interconnecting its conductors which, due to ...


4
Eric W Strid, Kimberly R Gleason: Wafer probe. Cascade Microtech, Dellett Smith Hill and Bedell, May 2, 1989: US04827211 (123 worldwide citation)

A wafer probe for accessing bonding pads on a planar device includes contact pads mounted on one edge of the under side of a dielectric substrate board and arranged to align with the bonding pads to be accessed. Coplanar ground and signal conductors deposited on the under side of the substrate board ...


5
Kimberly R Gleason, Eric W Strid, Robert T Flegal, Angus J McCamant: Wafer probes. TriQuint Semiconductor, John Smith Hill, William S Lovell, August 1, 1989: US04853627 (105 worldwide citation)

A wafer probe comprises a support member having an end region which is shaped to permit the end region to be brought into close proximity with a component under test. An amplifier is mounted on the support member at its end region. A conductive probe element is attached to the amplifier and is elect ...


6
Eric W Strid, Keith E Jones: System for setting reference reactance for vector corrected measurements. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, August 15, 1989: US04858160 (98 worldwide citation)

A system for calibrating vector corrected electrical measurements to adjust for distortion due to reactance in the measuring circuit, particularly that caused by variable positioning of a circuit element, such as probe or coupling. Initial error factors for directivity, source match, and frequency r ...


7
Eric W Strid: Wafer probe. Cascade Microtech, Dellett Smith Hill and Bedell, August 16, 1988: US04764723 (83 worldwide citation)

A wafer probe for testing semiconductor devices brings low impedance connections closely adjacent device bonding pads for bypassing power supply voltages.


8
Eric W Strid, Jerry B Schappacher, Dale E Carlton, K Reed Gleason: System for evaluating probing networks. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, October 1, 1996: US05561377 (65 worldwide citation)

An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the refere ...


9
K Reed Gleason, Tim Lesher, Eric W Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M E Safwat: Probe for testing a device under test. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, November 9, 2004: US06815963 (65 worldwide citation)

A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.


10
Eric W Strid, Jerry B Schappacher, Dale E Carlton, K Reed Gleason: Method of evaluating signal conditions in a probe measurement network having a plurality of separate measurement channels. Cascade Microtech, Chernoff Vilhauer McClung & Stenzel, August 19, 1997: US05659255 (56 worldwide citation)

A method of evaluating the signal conditions in a probe measurement network of the type having a plurality of separate measurement channels, where each channel communicates through a corresponding device-probing end. The method includes providing an assembly which includes a conductive planar probin ...